Senior Scientist, Multi-Layered Wiring

VTT Technical Research Centre of Finland; Espoo; On-site; EUR 90,000 - 140,000; Full time

Job summary

VTT Technical Research Centre of Finland seeks a Senior Scientist to own the multi-layered wiring technology for quantum scaling. You will lead process development, integration, and pilot production readiness for 200 mm wafers, while guiding a team and performing hands-on cleanroom work.

The role combines strategic direction with hands-on experimentation, focusing on lithography, deposition, etching, and end-to-end process optimization.

Qualifications

• PhD in a relevant field with strong research background.
• 6+ years of hands-on cleanroom experience (PhD or postdoc acceptable).
• Expert in lithography, dry etching, and deposition processes.
• Experience with DOE, metrology, SPC, yield analysis, and data-driven optimization.
• Track record of scaling R&D processes toward pilot production.
• Ability to own technical workstreams and mentor others.
• Experience with superconducting film integration or quantum device fabrication is a plus.

Responsibilities

• Lead development, optimization, and qualification of MW wiring on 200 mm wafers.
• Provide leadership in thin film deposition, lithography, etching, and processing.
• Define program and integration strategies for scale-up and tool-matching.
• Develop roadmaps for MLW modules aligned with QPU scaling goals.
• Design and run DOE campaigns with yield and performance targets.
• Establish SPC, process monitoring, yield KPIs, and guardrails.
• Lead data analysis to improve uniformity, reproducibility, and device performance.
• Plan production ramp-up, risk mapping, and pilot-scale readiness.
• Contribute to EU projects, publications, and external partnerships.
• Mentor junior colleagues and strengthen team capability and safety culture.

Skills

Micro/nanofabrication

DOE

Metrology

Data-driven optimization

Cleanroom

Process scale-up

Leadership

Education

PhD in applied physics / electrical engineering / materials science / micro/nanotechnology

Tools

Lithography

Dry etching

Wet processing

Thin film deposition

Integration flows

Job description

Are you a seasoned nanofabrication expert ready to take technical ownership of a critical quantum hardware technology? We are offering an opportunity to lead the development of superconducting multi-layered wiring processes from advanced R&D towards scalable, pilot-ready manufacturing. Would you like to shape process roadmaps, mentor colleagues, and remain deeply hands-on in world-class facilities? VTT might be just the place for you.

VTT is one of the leading applied research organisations in Europe. What unites us are curiosity, a passion for learning, and a purpose: to solve the biggest challenges of our time and turn them into sustainable growth and well-being. Our cross-disciplinary community of over 2000 brilliant minds from 55+ different nationalities focuses on creating impact through science-based innovation. In recent years, we have created ground-breaking innovations such as the world's fastest and most accurate radiation detector, a cancer-sniffing sensor device for smartphones, and a headphone set entirely made of microbial materials. Get to know us further by exploring VTT's tech & infra.

We are now looking for Senior Scientist, Multi-Layered Wiring to join our Quantum Scaling and Integration team.

You will join our Quantum Scaling and Integration Team and provide technical leadership across the full multi-layered wiring process stack on 200 mm wafers, from process development and integration to yield optimization and pilot-production readiness. In this senior role, you will work with significant autonomy, define technical priorities, lead process scale-up, and guide junior colleagues. You will combine strategic direction with hands-on cleanroom work and data-driven process improvement.

Our Quantum Scaling and Integration Team develops advanced technologies for scaling superconducting quantum processors, from TSVs and multilayer wiring to flip-chip integration and full QPU module concepts. We work closely with leading European industrial and academic partners to enable reproducible, wafer-scale fabrication and pilot-ready processes for future quantum computing systems.

As Senior Scientist, Multi-Layered Wiring, you will:

• Lead the development, optimization, and qualification of multi-layered superconducting wiring processes on 200 mm wafers
• Provide expert leadership in thin film deposition, lithography, dry etching, and wet processing
• Define and drive process integration, transfer, scaling, and tool-matching strategies
• Develop the technical roadmap for MLW modules in alignment with QPU scaling objectives
• Design and lead DOE campaigns with clear yield and performance targets
• Establish SPC, process monitoring, yield KPIs, and production-quality guardrails
• Lead characterization and data analysis to improve uniformity, reproducibility, and device performance
• Drive production ramp-up planning, risk mapping, and pilot-scale readiness
• Lead technical contributions to EU projects, publications, and external partnerships
• Mentor junior colleagues and strengthen team capability, documentation, and safety culture

Who we are looking for:

• For this position, we are looking for an experienced micro- and nanofabrication specialist who can take ownership of a complex technology area and lead its transition from research towards reproducible pilot-scale production.
• PhD in applied physics, electrical engineering, materials science, micro/nanotechnology, or similar
• At least 6 years of hands-on cleanroom experience, including PhD or postdoctoral work
• Expert-level experience in lithography, dry etching, wet processing, thin film deposition, and integration flows
• Strong experience with DOE, metrology, SPC, yield analysis, and data-driven process optimization
• Demonstrated track record of scaling R&D processes towards pilot production
• Ability to independently own technical workstreams and guide junior colleagues
• We also appreciate experience in experience with superconducting film integration or quantum device fabrication; knowledge of CMP, wafer bonding, or advanced packaging; familiarity with in-line characterization, mask design, RF simulations, or scientific programming.

As a person, we hope that you are:

• Strategic and hands-on, able to lead both from the cleanroom and the planning table
• A natural mentor who supports the development of junior colleagues
• Rigorous and data-driven, with a strong focus on reproducibility and documentation
• A proactive problem solver who turns technical complexity into clear priorities
• An excellent communicator with internal and external stakeholders
• Committed to quality, safety, collaboration, and continuous improvement

For further information, please contact Research Team Leader Harshad Mishra, [e-mail], [phone]

We look forward to hearing from you!

Employment type: full time

VTT

Location: Tietotie 3, Espoo

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