Lead Scientist, QPU & TSV Integration (200mm Wafer)
Moventas Wind Ltd
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Job summary
VTT is seeking a Senior Scientist, QPU Integration and TSV Technologies to lead superconducting TSV and QPU integration efforts on 200 mm wafers. You will own technical workstreams, define process strategies, drive yield improvement, and coordinate with European industrial and academic partners to accelerate pilot-scale readiness.
The role requires deep microfabrication expertise, a proven track record in scaling R&D to pilot production, and strong leadership to mentor researchers and engineers
Job description
VTT is seeking a Senior Scientist, QPU Integration and TSV Technologies to lead superconducting TSV and QPU integration efforts on 200 mm wafers. You will own technical workstreams, define process strategies, drive yield improvement, and coordinate with European industrial and academic partners to accelerate pilot-scale readiness.
The role requires deep microfabrication expertise, a proven track record in scaling R&D to pilot production, and strong leadership to mentor researchers and engineers
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