Senior Scientist, Multi-Layered Wiring

Moventas Wind Ltd; Espoo; Hybrid; EUR 90,000 - 120,000; Full time

Job summary

VTT is seeking a Senior Scientist, Multi-Layered Wiring, to lead the development of superconducting wiring processes for 200 mm wafers and drive pilot-scale production.

You will oversee lithography, deposition, etching, and process integration, while mentoring colleagues and advancing DOE-driven improvements. This role blends strategic planning with hands-on cleanroom work in a world-class facility.

Qualifications

• PhD in applied physics, electrical engineering, materials science, micro/nanotechnology, or similar
• At least 6 years of hands‑on cleanroom experience, including PhD or postdoc work
• Expert‑level experience in lithography, dry etching, wet processing, thin film deposition, and integration flows
• Strong experience with DOE, metrology, SPC, yield analysis, and data‑driven process optimization
• Demonstrated track record of scaling R&D processes towards pilot production
• Ability to independently own technical workstreams and guide junior colleagues
• Experience with superconducting film integration or quantum device fabrication; knowledge of CMP, wafer bonding, or advanced packaging; RF simulations; in‑line characterization; mask design; scientific programming

Responsibilities

• Lead development and qualification of multi-layered superconducting wiring processes on 200 mm wafers
• Provide leadership in thin film deposition, lithography, dry etching, and wet processing
• Define and drive process integration, transfer, scaling, and tool-matching strategies
• Develop the technical roadmap for MLW modules aligned with QPU scaling goals
• Design and lead DOE campaigns with clear yield and performance targets
• Establish SPC, process monitoring, yield KPIs, and production-quality guardrails
• Lead characterization and data analysis to improve uniformity and device performance
• Drive production ramp-up planning, risk mapping, and pilot-scale readiness
• Contribute to EU projects, publications, and external partnerships
• Mentor junior colleagues and strengthen team capability, documentation, and safety culture

Skills

DOE

Metrology

Data-driven optimization

Pilot-scale production

Education

PhD in applied physics/electrical engineering/materials science

Tools

Lithography tools

Dry etching equipment

Thin film deposition tools

RF simulations

Job description

Are you a seasoned nanofabrication expert ready to take technical ownership of a critical quantum hardware technology? We are offering an opportunity to lead the development of superconducting multi-layered wiring processes from advanced R&D towards scalable, pilot-ready manufacturing. Would you like to shape process roadmaps, mentor colleagues, and remain deeply hands-on in world-class facilities? VTT might be just the place for you.

VTT is one of the leading applied research organisations in Europe. What unites us are curiosity, a passion for learning, and a purpose: to solve the biggest challenges of our time and turn them into sustainable growth and well-being. Our cross-disciplinary community of over 2000 brilliant minds from 55+ different nationalities focuses on creating impact through science-based innovation. In recent years, we have created ground-breaking innovations such as the world's fastest and most accurate radiation detector, a cancer-sniffing sensor device for smartphones, and a headphone set entirely made of microbial materials. Get to know us further by exploring VTT's tech & infra.

We are now looking for Senior Scientist, Multi-Layered Wiring to join our Quantum Scaling and Integration team.

You will join our Quantum Scaling and Integration Team and provide technical leadership across the full multi-layered wiring process stack on 200 mm wafers, from process development and integration to yield optimization and pilot-production readiness. In this senior role, you will work with significant autonomy, define technical priorities, lead process scale-up, and guide junior colleagues. You will combine strategic direction with hands‑on cleanroom work and data‑driven process improvement.

Our Quantum Scaling and Integration Team develops advanced technologies for scaling superconducting quantum processors, from TSVs and multilayer wiring to flip-chip integration and full QPU module concepts. We work closely with leading European industrial and academic partners to enable reproducible, wafer-scale fabrication and pilot-ready processes for future quantum computing systems.

As Senior Scientist, Multi-Layered Wiring, you will:

• Lead the development, optimization, and qualification of multi-layered superconducting wiring processes on 200 mm wafers
• Provide expert leadership in thin film deposition, lithography, dry etching, and wet processing
• Define and drive process integration, transfer, scaling, and tool-matching strategies
• Develop the technical roadmap for MLW modules in alignment with QPU scaling objectives
• Design and lead DOE campaigns with clear yield and performance targets
• Establish SPC, process monitoring, yield KPIs, and production-quality guardrails
• Lead characterization and data analysis to improve uniformity, reproducibility, and device performance
• Drive production ramp-up planning, risk mapping, and pilot-scale readiness
• Lead technical contributions to EU projects, publications, and external partnerships
• Mentor junior colleagues and strengthen team capability, documentation, and safety culture

Who we are looking for:

• For this position, we are looking for an experienced micro- and nanofabrication specialist who can take ownership of a complex technology area and lead its transition from research towards reproducible pilot-scale production.
• PhD in applied physics, electrical engineering, materials science, micro/nanotechnology, or similar
• At least 6 years of hands‑on cleanroom experience, including PhD or postdoctoral work
• Expert‑level experience in lithography, dry etching, wet processing, thin film deposition, and integration flows
• Strong experience with DOE, metrology, SPC, yield analysis, and data‑driven process optimization
• Demonstrated track record of scaling R&D processes towards pilot production
• Ability to independently own technical workstreams and guide junior colleagues
• We also appreciate experience in experience with superconducting film integration or quantum device fabrication; knowledge of CMP, wafer bonding, or advanced packaging; familiarity with in‑line characterization, mask design, RF simulations, or scientific programming.

As a person, we hope that you are:

• Strategic and hands‑on, able to lead both from the cleanroom and the planning table
• A natural mentor who supports the development of junior colleagues
• Rigorous and data‑driven, with a strong focus on reproducibility and documentation
• A proactive problem solver who turns technical complexity into clear priorities
• An excellent communicator with internal and external stakeholders
• Committed to quality, safety, collaboration, and continuous improvement

For further information, please contact Research Team Leader Harshad Mishra, [e-mail], [phone]

Apply between 7 September 2026 and 23 September 2026 23:59 (Europe/Helsinki)

A security clearance procedure is conducted during the recruitment process.