Head of Advanced Packaging & Backend Fabrication

Entangled Future; Espoo; Hybride; EUR 110 000 - 170 000; Plein temps

Résumé du poste

IQM Quantum Computers in Espoo leads the development of backend fabrication and advanced packaging for next-gen QPU devices. You will head a new backend and packaging team, bridging research, process engineering, and production to deliver reproducible, manufacturable processes.

You will coach experienced engineers, set priorities, and manage cleanroom capacity while aligning with QPU roadmaps and product requirements.

Qualifications

• Leadership experience guiding engineers in a high-tech environment.
• Experience in backend fabrication and advanced packaging.
• Ability to translate research concepts into manufacturable processes.

Responsabilités

• Lead, coach, and develop engineers in backend fabrication and packaging.
• Set priorities and allocate resources against QPU roadmaps and cleanroom capacity.
• Drive technology maturation from research to robust, transferable processes.
• Define development plans, milestones, and process-readiness criteria.
• Guide experiments and review results to decide next iterations.
• Ensure data traceability to device performance and reliability.

Connaissances

Leadership

Team coaching

Advanced packaging

Process engineering

Project management

Resource planning

Data-driven

Outils

Cleanroom equipment

Measurement instruments

QA systems

Description du poste

IQM Quantum Computers in Espoo leads the development of backend fabrication and advanced packaging for next-gen QPU devices. You will head a new backend and packaging team, bridging research, process engineering, and production to deliver reproducible, manufacturable processes.

You will coach experienced engineers, set priorities, and manage cleanroom capacity while aligning with QPU roadmaps and product requirements.