Team Leader, Advanced Packaging

Entangled Future; Espoo; Hybrid; EUR 110,000 - 170,000; Full time

Job summary

IQM Quantum Computers in Espoo leads the development of backend fabrication and advanced packaging for next-gen QPU devices. You will head a new backend and packaging team, bridging research, process engineering, and production to deliver reproducible, manufacturable processes.

You will coach experienced engineers, set priorities, and manage cleanroom capacity while aligning with QPU roadmaps and product requirements.

Qualifications

• Leadership experience guiding engineers in a high-tech environment.
• Experience in backend fabrication and advanced packaging.
• Ability to translate research concepts into manufacturable processes.

Responsibilities

• Lead, coach, and develop engineers in backend fabrication and packaging.
• Set priorities and allocate resources against QPU roadmaps and cleanroom capacity.
• Drive technology maturation from research to robust, transferable processes.
• Define development plans, milestones, and process-readiness criteria.
• Guide experiments and review results to decide next iterations.
• Ensure data traceability to device performance and reliability.

Skills

Leadership

Team coaching

Advanced packaging

Process engineering

Project management

Resource planning

Data-driven

Tools

Cleanroom equipment

Measurement instruments

QA systems

Job description

Team Leader, Advanced Packaging at IQM Quantum Computers, Espoo, FI. A lead-level full time position in the Engineering team, listed under hardware engineering.

As Team Leader, Advanced Packaging, you'll lead the team developing backend fabrication processes and advanced packaging technologies for next-generation QPUs. You own the interface between early-stage research, proof of concept, process engineering, and production: your job is to turn promising concepts into well-understood, reproducible, manufacturable processes that transfer cleanly into production. You'll join QPU Development Engineering in Espoo, reporting to the Team Leader, QPU Development Engineering, and build up a new, dedicated backend and advanced packaging team. Day to day you'll work with Process Engineering, Equipment, Micro-packaging, Design, System Engineering, Measurement, Reliability, and Quality, alongside our research groups and the cleanroom and facilities teams.

This is leadership on two fronts at once: coaching experienced engineers, and setting technical direction, priorities, and cleanroom capacity calls. In your first six months, you'll have the team's development plan, milestones, and process-readiness criteria in place, and visible progress on the backend roadmap for the next generation's QPU packaging.

What you’ll actually do

• Lead, coach, and develop the engineers working on backend fabrication, advanced packaging, and process integration
• Set development priorities and allocate resources against QPU roadmaps, project needs, technical risk, and available cleanroom capacity
• Drive technology maturation from research and proof of concept into robust, transferable fabrication processes
• Define development plans, technical milestones, success criteria, and process-readiness expectations
• Guide hypothesis-driven experiments, review results and technical conclusions with the team, and decide the next iteration
• Keep development work data-based, traceable, and tied to QPU and product requirements: device performance, yield, reliability, scalability