Lead, Advanced Packaging & Backend Fabrication

IQM Quantum Computers; Espoo; On-site; EUR 120,000 - 180,000; Full time

Benefits offered by this job

Hybrid work options

Job summary

IQM Quantum Computers in Espoo, Finland, is seeking a Team Leader for Advanced Packaging to lead backend fabrication and packaging for the next generation of QPUs. You will coach engineers, set roadmaps, and ensure that promising concepts become robust, production-ready processes that transfer to manufacturing.

You will coordinate closely with Research, QPU Development, Process Engineering, Equipment, Measurement, System Engineering, Reliability, Quality, and Production to ensure alignment and

Qualifications

• Master's degree in materials science, physics, electrical or chemical engineering, nanotechnology, or related field.
• 5+ years in semiconductor manufacturing, microelectronics, advanced packaging, quantum technologies, or comparable high-tech industry.
• 2-3+ years leading technical teams, projects, or multidisciplinary engineering activities, with coaching experience.
• Hands-on backend process development and process integration experience.
• Track record of taking technology from early phase to engineering or production readiness.
• Strong data-driven decision making and structured problem solving.
• Stakeholder management and cross-functional collaboration; ability to simplify complex topics for engineers, production, and senior management.
• Comfort deciding under uncertainty in a fast-moving R&D environment, and professional level English.

Responsibilities

• Lead, coach, and develop engineers working on backend fabrication, advanced packaging, and process integration.
• Set development priorities and allocate resources against roadmaps, project needs, risk, and cleanroom capacity.
• Drive technology maturation from research and proof of concept into robust, transferable fabrication processes.
• Define development plans, milestones, success criteria, and process-readiness expectations.
• Guide hypothesis-driven experiments, review results and conclusions, and decide next iterations.
• Keep development data-based, traceable, and tied to device performance, yield, reliability, and scalability.
• Judge when a process is mature enough to hand to Process Engineering or Production and ensure transfer carries specs and training.

Skills

Team leadership

Backend process development

Process integration

Data-driven decision making

Cross-functional collaboration

English proficiency

Education

Master's degree in materials science, physics, electrical or chemical engineering, nanotechnology, microelectronics, or related discipline

Job description

IQM Quantum Computers in Espoo, Finland, is seeking a Team Leader for Advanced Packaging to lead backend fabrication and packaging for the next generation of QPUs. You will coach engineers, set roadmaps, and ensure that promising concepts become robust, production-ready processes that transfer to manufacturing.

You will coordinate closely with Research, QPU Development, Process Engineering, Equipment, Measurement, System Engineering, Reliability, Quality, and Production to ensure alignment and