Postdoctoral Scientist - Thin-Film & Via Metallization

ICFO - The Institute of Photonic Sciences; España; Vor Ort; EUR 38.000 - 54.000; Vollzeit

Benefits dieser Stelle

Facilities access to microfabrication

Interdisciplinary research environment

Family allowance may be granted

Zusammenfassung

ICFO - The Institute of Photonic Sciences in Castelldefels, near Barcelona, seeks a post‑doctoral engineer/scientist with expertise in thin‑film deposition and metallization for high‑aspect‑ratio glass vias. You will develop seed‑layer deposition, surface activation, and adhesion/barrier stacks for copper interconnects in cutting-edge PIC packaging.

The role reports to the PI overseeing PIXEurope and involves scaling deposition processes, ensuring conformity across vias, and collaborating with

Qualifikationen

• PhD in a relevant field or equivalent research experience.
• Hands-on experience with thin-film deposition and surface activation.
• Experience in metallization for semiconductor, MEMS, or advanced packaging.
• Knowledge of glass/dielectric surfaces and adhesion/barrier layers.

Aufgaben

• Develop and optimize seed-layer deposition for high‑aspect‑ratio Through‑Glass Vias (TGVs).
• Establish substrate cleaning, activation, and adhesion‑promotion workflows.
• Design adhesion, barrier, and seed stacks (Ti/Cu, Cr/Cu, TiW/Cu) and related systems.
• Advance sputtering, evaporation, ALD, CVD, or electroless deposition methods.
• Ensure continuous, conformal seed coverage along via entrances and sidewalls.
• Characterize thickness, morphology, resistivity, adhesion and uniformity.
• Collaborate with laser/glass teams on via geometry alignment for plating.

Kenntnisse

Thin-film deposition

Surface activation

Metallization

Glass/ dielectric surface chemistry

Adhesion & barrier layers

Characterisation (thickness, resist.)

Wafer-level uniformity

Ausbildung

PhD in materials science, chemistry, chemical engineering, electrical engineering, microelectronics, physics, microengineering or related fields

Tools

FIB/SEM

X-ray inspection

Four-point-probe

Electroplating

ALD/CVD tooling

Jobbeschreibung

ICFO - The Institute of Photonic Sciences in Castelldefels, near Barcelona, seeks a post‑doctoral engineer/scientist with expertise in thin‑film deposition and metallization for high‑aspect‑ratio glass vias. You will develop seed‑layer deposition, surface activation, and adhesion/barrier stacks for copper interconnects in cutting-edge PIC packaging.

The role reports to the PI overseeing PIXEurope and involves scaling deposition processes, ensuring conformity across vias, and collaborating with