Postdoc: TGV Metallization & Seed-Layer Expert

Institute of Photonic Sciences; Castelldefels; On-site; EUR 42,000 - 54,000; Full time

Job summary

ICFO invites applications for a postdoctoral researcher position within the PICs@ICFO Strategic Initiative focused on Through-Glass Vias metallization and seed-layer processes. The successful candidate will develop and optimize seed layers and deposition methods for high-aspect-ratio vias in glass to enable copper interconnects.

The role emphasizes hands-on thin-film deposition, surface activation, adhesion promotion, and integration with subsequent plating steps, in collaboration with the

Qualifications

• Hands-on experience in thin-film deposition and metallization for semiconductor/packaging contexts.
• Experience with high-aspect-ratio Through-Glass Vias and seed layers.
• Familiarity with surface cleaning, activation, and adhesion-promotion processes.
• Knowledge of seed-layer stacks (e.g., Ti/Cu, Cr/Cu, TiW/Cu) and interconnect integration.
• Ability to optimize multiple deposition methods (sputtering, evaporation, ALD/CVD).

Responsibilities

• Develop and optimize seed-layer deposition processes for high-aspect-ratio Through-Glass Vias
• Develop substrate cleaning, glass-surface activation, and adhesion-promotion processes
• Develop adhesion, barrier, and conductive seed stacks such as Ti/Cu, Cr/Cu, TiW/Cu
• Optimize sputtering, evaporation, electroless, ALD or CVD-assisted, and hybrid deposition approaches
• Achieve continuous and conformal seed coverage along via entrances, sidewalls, and exits
• Characterize thickness, morphology, resistivity, adhesion, continuity, and wafer-level uniformity
• Identify and mitigate shadowing, seed discontinuity, oxidation, delamination, and cracking
• Coordinate with the laser and glass team to align via geometry and surface condition with seeding, plating, and interconnection requirements

Skills

Thin-film deposition

Seed-layer deposition

Surface activation

Metallization

Sputtering

ALD/CVD

Characterization

Tools

Sputtering systems

Evaporation

Electroless plating

ALD

CVD

Job description

ICFO invites applications for a postdoctoral researcher position within the PICs@ICFO Strategic Initiative focused on Through-Glass Vias metallization and seed-layer processes. The successful candidate will develop and optimize seed layers and deposition methods for high-aspect-ratio vias in glass to enable copper interconnects.

The role emphasizes hands-on thin-film deposition, surface activation, adhesion promotion, and integration with subsequent plating steps, in collaboration with the