PICs@ICFO Strategic Initiative: Junior Process Engineer in PIC Packaging

BIST People Working Group; Castelldefels; On-site; EUR 32,000 - 42,000; Full time

Benefits offered by this job

Full-time contract

State-of-the-art facilities

Hands-on packaging experience

Family allowance

Job summary

ICFO is seeking a Junior Process Engineer in PIC Packaging to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The selected candidate will work in an advanced R&D pilot-line environment, developing processes and solving engineering challenges.

You will collaborate with multidisciplinary teams to implement scalable packaging solutions and advance PIC technologies from design to testing and applications.

Qualifications

• Degree in Electronics, Microelectronics Engineering, Photonics or related field.
• Demonstrated experience with precision equipment in academics, R&D or industry.
• Familiarity with semiconductor processes is a plus.

Responsibilities

• Develop and optimize die assembly and interconnection processes for electronic and photonic devices (die attach, solder reflow, wire bonding, solder bumping).
• Set up, program, and operate semi-automated equipment for process development and prototyping.
• Support material/component selection and supplier qualification for process compatibility and quality.
• Optimize packaging processes through thermo-mechanical testing (die shear, wire pull, thermal cycling).
• Collaborate with optical, mechanical, RF, and test engineers to implement scalable packaging solutions.

Skills

Die assembly

Wire bonding

Solder reflow

Education

Bachelor’s or Master’s in Electronics/Microelectronics/Photonics

FP Grado Superior/related engineering degree

Tools

Die attach equipment

Wire bonding equipment

Solder reflow ovens

Job description

DESCRIPTION

As part of the PICs@ICFO Strategic Initiative, ICFO is currently coordinating the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project, both major initiatives aimed at advancing Photonic Integrated Circuits (PICs) in Europe. These projects strengthen ICFO’s strategic positioning across the entire PIC development pipeline — from design and fabrication to packaging, testing, and real-world applications.

Position Overview

We are seeking a Junior Process Engineer in PIC Packaging, to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The selected candidate will play a key role in the experimental development of advanced PIC technologies within the PICs@ICFO Strategic Initiative.

This is a highly hands‑on position in an advanced R&D pilot‑line environment, ideally suited for candidates who enjoy working with manufacturing equipment, developing processes, and solving practical engineering challenges.

We welcome applications from motivated candidates eager to learn and grow in the field of photonics packaging.

Key Responsibilities

• Develop and optimize die assembly and interconnection processes for electronic and photonic devices, including die attach, solder reflow, wire bonding, solder bumping and other related packaging processes.
• Set up, program, and operate semi‑automated equipment for process development and prototyping.
• Support the selection and qualification of materials, components, and suppliers to ensure process compatibility and quality.
• Optimize packaging processes through experimental evaluation, including thermo‑mechanical integrity and reliability testing (e.g., die shear, wire pull, thermal cycling).
• Collaborate closely with multidisciplinary teams including optical, mechanical, RF, and test engineers to implement scalable and manufacturable packaging solutions.

This position will report to the Prof. Dr. Valerio Pruneri, Scientific Coordinator of the PICs@ICFO Strategic Initiative encompassing the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project.

REQUIREMENTS & CONDITIONS

Applicants must hold FP Grado Superior, Bachelor’s, or Master’s Degree in Electronics, Microelectronics Engineering, Photonics, or a related field.

• demonstrated experience working with precision equipment and instrumentation, in academics, R&D or industrial environment.
• familiarity with semiconductor processes and environment is a plus

The ideal candidate is pragmatic and detail‑oriented, collaborative and motivated to work in a multidisciplinary environment bridging research and industrial applications.

What We Offer

• Full‑time contract for scientific and technical activities pursuant to Spanish Law 14/2011, linked to the Catalan PhotonChip project.
• Access to state‑of‑the‑art facilities for Photonic Packaging and Testing.
• Opportunity to develop hands‑on expertise in advanced packaging technologies at the interface between academia and industry.
• A family allowance may be granted to candidates with dependents, in accordance with ICFO policies.

Equal Opportunity

ICFO is an equal opportunity employer. We hire based solely on merit and potential, regardless of gender, nationality, or disability. ICFO fully endorses the European Charter for Researchers and Code of Conduct for the Recruitment of Researchers, ensuring a transparent and supportive recruitment process.

DEADLINE

30th of October, 2026