PICs@ICFO Strategic Initiative: Junior Process Engineer in PIC Packaging

Institute of Photonic Sciences; Castelldefels; In loco; EUR 35.000 - 51.000; Tempo pieno

Descrizione del lavoro

Institute of Photonic Sciences (ICFO) invites applications for a Junior Process Engineer in PIC Packaging within the PICs@ICFO Strategic Initiative. The role supports development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs) in an advanced R&D pilot-line environment.

You will work hands-on with manufacturing equipment, develop processes, and solve practical engineering challenges while collaborating with optical, mechanical, RF, and test engineers to deliver

Mansioni

• Develop and optimize die assembly and interconnection processes for electronic and photonic devices (die attach, solder reflow, wire bonding, solder bumping).
• Set up, program, and operate semi-automated equipment for process development and prototyping.
• Support the selection and qualification of materials, components, and suppliers to ensure process compatibility and quality.
• Optimize packaging processes via experimental evaluation, including reliability testing.
• Collaborate with optical, mechanical, RF, and test engineers to implement scalable packaging solutions.

Descrizione del lavoro

PICs@ICFO Strategic Initiative: Junior Process Engineer in PIC Packaging

As part of the PICs@ICFO Strategic Initiative, ICFO is currently coordinating the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project, both major initiatives aimed at advancing Photonic Integrated Circuits (PICs) in Europe. These projects strengthen ICFO’s strategic positioning across the entire PIC development pipeline — from design and fabrication to packaging, testing, and real-world applications.

Position Overview

We are seeking a Junior Process Engineer in PIC Packaging, to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The selected candidate will play a key role in the experimental development of advanced PIC technologies within the PICs@ICFO Strategic Initiative.

This is a highly hands‑on position in an advanced R&D pilot‑line environment, ideally suited for candidates who enjoy working with manufacturing equipment, developing processes, and solving practical engineering challenges.

We welcome applications from motivated candidates eager to learn and grow in the field of photonics packaging.

Key Responsibilities:

• Develop and optimize die assembly and interconnection processes for electronic and photonic devices, including die attach, solder reflow, wire bonding, solder bumping and other related packaging processes.
  
• Set up, program, and operate semi-automated equipment for process development and prototyping.
  
• Support the selection and qualification of materials, components, and suppliers to ensure process compatibility and quality.
  
• Optimize packaging processes through experimental evaluation, including thermo-mechanical integrity and reliability testing (e.g., die shear, wire pull, thermal cycling).
  
• Collaborate closely with multidisciplinary teams including optical, mechanical, RF, and test engineers to implement scalable and manufacturable packaging solutions.
  

This position will report to the Prof. Dr. Valerio Pruneri, Scientific Coordinator of the PICs@ICFO Strategic Initiative encompassing the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project.