Junior Photonic Packaging Engineer

BIST People Working Group; Castelldefels; On-site; EUR 32,000 - 42,000; Full time

Benefits offered by this job

Full-time contract

State-of-the-art facilities

Hands-on packaging experience

Family allowance

Job summary

ICFO is seeking a Junior Process Engineer in PIC Packaging to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The selected candidate will work in an advanced R&D pilot-line environment, developing processes and solving engineering challenges.

You will collaborate with multidisciplinary teams to implement scalable packaging solutions and advance PIC technologies from design to testing and applications.

Qualifications

• Degree in Electronics, Microelectronics Engineering, Photonics or related field.
• Demonstrated experience with precision equipment in academics, R&D or industry.
• Familiarity with semiconductor processes is a plus.

Responsibilities

• Develop and optimize die assembly and interconnection processes for electronic and photonic devices (die attach, solder reflow, wire bonding, solder bumping).
• Set up, program, and operate semi-automated equipment for process development and prototyping.
• Support material/component selection and supplier qualification for process compatibility and quality.
• Optimize packaging processes through thermo-mechanical testing (die shear, wire pull, thermal cycling).
• Collaborate with optical, mechanical, RF, and test engineers to implement scalable packaging solutions.

Skills

Die assembly

Wire bonding

Solder reflow

Education

Bachelor’s or Master’s in Electronics/Microelectronics/Photonics

FP Grado Superior/related engineering degree

Tools

Die attach equipment

Wire bonding equipment

Solder reflow ovens

Job description

ICFO is seeking a Junior Process Engineer in PIC Packaging to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The selected candidate will work in an advanced R&D pilot-line environment, developing processes and solving engineering challenges.

You will collaborate with multidisciplinary teams to implement scalable packaging solutions and advance PIC technologies from design to testing and applications.