Junior PIC Packaging Engineer - Hands-on Process Innovator

Institute of Photonic Sciences; Castelldefels; On-site; EUR 35,000 - 51,000; Full time

Job summary

Institute of Photonic Sciences (ICFO) invites applications for a Junior Process Engineer in PIC Packaging within the PICs@ICFO Strategic Initiative. The role supports development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs) in an advanced R&D pilot-line environment.

You will work hands-on with manufacturing equipment, develop processes, and solve practical engineering challenges while collaborating with optical, mechanical, RF, and test engineers to deliver

Responsibilities

• Develop and optimize die assembly and interconnection processes for electronic and photonic devices (die attach, solder reflow, wire bonding, solder bumping).
• Set up, program, and operate semi-automated equipment for process development and prototyping.
• Support the selection and qualification of materials, components, and suppliers to ensure process compatibility and quality.
• Optimize packaging processes via experimental evaluation, including reliability testing.
• Collaborate with optical, mechanical, RF, and test engineers to implement scalable packaging solutions.

Job description

Institute of Photonic Sciences (ICFO) invites applications for a Junior Process Engineer in PIC Packaging within the PICs@ICFO Strategic Initiative. The role supports development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs) in an advanced R&D pilot-line environment.

You will work hands-on with manufacturing equipment, develop processes, and solve practical engineering challenges while collaborating with optical, mechanical, RF, and test engineers to deliver