Senior Photonics Packaging Engineer: Turn PICs into Modules

Phanofi; København; Vor Ort; DKK 900.000 - 1.300.000; Vollzeit

Benefits dieser Stelle

Stock options

Healthcare insurance

Professional development support

Free snacks

5 weeks paid holiday

Maternity/paternity leave

Zusammenfassung

Phanofi in Copenhagen is seeking a Senior Photonics Packaging Engineer to own the end-to-end packaging of PICs, from optical to electrical interfaces and interposers, ensuring robust, manufacturable modules.

You will develop packaging methods toward pilot-production, characterize outcomes, debug as needed, and feed findings into design reviews to optimize yield and scale for a small, fast-moving team.

Qualifikationen

• 5+ years of hands-on experience in photonics packaging and ownership of at least one packaging technology from lab prototype toward pilot production.
• Strong engineering or scientific background in photonics, integrated optics or related field with experience in packaging, optical coupling, RF/DC interfaces and interposer/substrate technologies.
• Experience with optical characterisation methods and instrumentation, and the ability to interpret data.

Aufgaben

• Own the packaging of PICs end to end, spanning optical interface, electrical interface and interposer to create robust, manufacturable modules.
• Advance packaging methods toward repeatable, pilot-production-ready processes; characterise builds and feed results back into design reviews to ensure yield and manufacturability.
• Help establish engineering and characterisation processes for a small, fast-moving deep-tech team and scale as we grow.

Kenntnisse

5+ years in photonics packaging

Photonics/optics background

Optical characterisation methods

Collaboration & communication

Ausbildung

Master's or PhD in Photonics / Optical Engineering / Electrical Engineering / Physics

Jobbeschreibung

Phanofi in Copenhagen is seeking a Senior Photonics Packaging Engineer to own the end-to-end packaging of PICs, from optical to electrical interfaces and interposers, ensuring robust, manufacturable modules.

You will develop packaging methods toward pilot-production, characterize outcomes, debug as needed, and feed findings into design reviews to optimize yield and scale for a small, fast-moving team.