Senior Photonics Packaging Engineer — Lab to Pilot + Stock

The Hub/Danske Bank; Kongens Lyngby; On-site; DKK 900,000 - 1,200,000; Full time

Benefits offered by this job

Performance-based stock options

Healthcare insurance

Professional development support

Free snacks

5 weeks of paid holiday

Maternity/paternity leave

Job summary

Phanofi seeks a Senior Photonics Packaging Engineer to lead the transition of PICs from lab to packaged modules. You will collaborate with electronic, R&D, and photonic teams and the CTO to shape technical direction for scalable products.

You will own end-to-end packaging, spanning optical fiber attach, alignment, bonding, RF/DC interfaces and interposer technology, ensuring manufacturability and yield.

Qualifications

• 5+ years in photonics engineering with deep hands-on PIC packaging experience.
• Ownership of at least one packaging technology from lab prototype toward pilot production.
• Strong background in photonics, integrated optics, or related field with broad packaging knowledge.
• Experience interpreting optical, RF and DC data and translating it into design choices.

Responsibilities

• Own the PIC packaging end-to-end from functional die to manufacturable module.
• Address optical interface, electrical interface, and interposer/substrate considerations.
• Advance packaging methods toward repeatable, pilot-production processes and characterize results.
• Integrate packaging constraints into design reviews to ensure yield and packageability.

Skills

Photonic packaging

Lab-to-pilot production

Optical coupling

RF/DC interfaces

Interposer/substrate tech

Education

Master's or PhD in Photonics, Optical Engineering, Electrical Engineering, or related field

Job description

Phanofi seeks a Senior Photonics Packaging Engineer to lead the transition of PICs from lab to packaged modules. You will collaborate with electronic, R&D, and photonic teams and the CTO to shape technical direction for scalable products.

You will own end-to-end packaging, spanning optical fiber attach, alignment, bonding, RF/DC interfaces and interposer technology, ensuring manufacturability and yield.