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Phanofi in Copenhagen is seeking a Senior Photonics Packaging Engineer to own the end-to-end packaging of PICs, from optical to electrical interfaces and interposers, ensuring robust, manufacturable modules.
You will develop packaging methods toward pilot-production, characterize outcomes, debug as needed, and feed findings into design reviews to optimize yield and scale for a small, fast-moving team.
The Mission
Phanofi is a DTU spin-out building the next generation of optical communication infrastructure. We design integrated photonic interconnect chips that reduce power consumption and increase data throughput for AI datacenters, quantum computing, and space applications.
The Mission
Phanofi is a DTU spin-out building the next generation of optical communication infrastructure. We design integrated photonic interconnect chips that reduce power consumption and increase data throughput for AI datacenters, quantum computing, and space applications.
Getting photonic integrated circuits (PICs) out of the lab and into packaged, manufacturable modules is one of the hardest problems in our field, and often the one that decides whether a promising chip becomes a product. As a diverse team of 16, we are at an inflection point, growing our engineering capability to take our photonic interconnect technology from prototype toward scalable, production-ready products.
As Senior Photonics Packaging Engineer, you own that transition. You will work in tight collaboration with our electronic, R&D and photonic engineers and our CTO, with real influence over technical direction as we scale.
Key Responsibilities
You own the packaging of our PICs end to end: turning a functional die into a robust, manufacturable module. In practice that spans the optical interface (fiber attach, alignment and bonding), the electrical interface (from DC and control lines through to high-speed RF interconnect), and the substrate or interposer that ties them together, glass, silicon, ceramic or organic. Few people have worked on all of these in equal depth, and we don't expect you to have. We do expect you to understand how a choice in one area constrains the others, and to be able to reason through the trade-offs with us.
Alongside the builds, you'll advance our packaging methods from bench-level assembly toward repeatable, pilot-production-ready processes, characterise what you build yourself and use the results to debug and refine, and bring packaging constraints upstream into design reviews so that packageability and yield are designed in rather than fixed later. You'll also help establish engineering and characterisation processes that suit a small, fast-moving team today and still hold up as we grow.
What We Are Looking For