Senior Photonics Packaging Engineer

Intellectual Capital Resources Ltd; København; On-site; DKK 120,000 - 160,000; Full time

Job summary

Intellectual Capital Resources Ltd. is seeking a Senior Photonics Packaging Engineer to take photonic integrated circuits from prototype to manufacturable products.

The role covers optical, electrical and mechanical integration of advanced PICs in a fast-growing photonics environment. You will own packaging, develop optical coupling solutions, define electrical interfaces, and support substrate and interposer selections across multiple platforms.

Qualifications

• 5+ years in photonics engineering with hands-on PIC packaging experience.
• Experience maturing lab prototypes to volume manufacture.
• Strong knowledge of optical coupling, alignment and attachment techniques.
• Understanding photonic assembly processes and packaging technologies.
• Experience with high-speed electrical interfaces, RF connectivity or optoelectronic integration.
• Ability to perform and interpret optical characterization and validation measurements.

Responsibilities

• Own the packaging of photonic integrated circuits from prototype to production-ready modules.
• Develop optical coupling solutions including fibre alignment, attachment and bonding processes.
• Define and optimise electrical interfaces including DC, RF and high-speed interconnect architectures.
• Support substrate and interposer selection across silicon, glass, ceramic and organic platforms.
• Develop scalable assembly and packaging processes for pilot production.
• Perform optical characterization, testing and failure analysis of packaged devices.
• Use experimental results to improve package performance, manufacturability and yield.
• Collaborate with photonics, electronics and R&D teams to ensure packaging requirements are integrated into product development.
• Collaborate with external assembly, substrate and foundry partners to deliver packaging solutions.
• Establish engineering processes, documentation and best practices as the company scales.

Skills

PIC packaging

Optical coupling

High-speed interfaces

Electrical/electronic integration

Mechanical packaging

Tools

Photonic design tools

Job description

My client is looking for a Senior Photonics Packaging Engineer role, focused on taking photonic integrated circuits from prototype through to manufacturable products. Senior Photonics Packaging Engineer position covering optical, electrical and mechanical integration of advanced PICs.This is an exciting opportunity within a fast-growing photonics company developing next-generation optical interconnect technologies, such as Quantum or AI applications.

Responsibilities

• Own the packaging of photonic integrated circuits from prototype through to production-ready modules
• Develop optical coupling solutions including fibre alignment, attachment and bonding processes
• Define and optimise electrical interfaces including DC, RF and high-speed interconnect architectures
• Support substrate and interposer selection across silicon, glass, ceramic and organic platforms
• Develop scalable assembly and packaging processes suitable for pilot production
• Perform optical characterisation, testing and failure analysis of packaged devices
• Use experimental results to improve package performance, manufacturability and yield
• Work closely with photonics, electronics and R&D teams to ensure packaging requirements are incorporated into product development
• Collaborate with external assembly, substrate and foundry partners to deliver packaging solutions
• Establish engineering processes, documentation and best practices as the company scales

Requirements

• 5+ years experience in photonics engineering with strong hands‑on PIC packaging experience
• Experience developing photonic packaging solutions from laboratory prototypes towards volume manufacture
• Strong understanding of optical coupling, alignment and attachment techniques
• Knowledge of photonic assembly processes and packaging technologies
• Experience with high‑speed electrical interfaces, RF connectivity or optoelectronic integration
• Ability to perform and interpret optical characterisation and validation measurements
• Strong problem‑solving skills and understanding of packaging trade‑offs
• Ability to work independently within a small, fast‑paced engineering team

Desirable

• Experience with photonic design or optical modelling tools
• Experience with reliability qualification and environmental testing
• Experience working with foundries, substrate vendors or assembly partners
• Knowledge of advanced packaging technologies, RF packaging or photonic interconnect systems
• Startup or scale‑up experience within photonics or semiconductor environments