Senior Photonics Packaging Engineer — PIC to Production

IC Resources; København; Vor Ort; DKK 1.000.000 - 1.400.000; Vollzeit

Zusammenfassung

IC Resources seeks a Senior Photonics Packaging Engineer to drive photonic integrated circuits from prototype to manufacturable products, delivering reliable optical, electrical and mechanical integration for next-generation PIC-based modules.

You will own the packaging program, develop fibre coupling and bonding processes, define high-speed interconnect architectures, select substrates, and collaborate closely with R&D, foundries and partners to scale production while optimizing yield and

Qualifikationen

• 5+ years of photonics engineering with hands-on PIC packaging experience.
• Experience moving photonic packaging from lab prototypes to volume manufacturing.
• Strong understanding of optical coupling, alignment and attachment techniques.
• Knowledge of photonic assembly processes and packaging technologies.
• Experience with high-speed electrical interfaces, RF or optoelectronic integration.
• Ability to perform optical characterization and validation measurements.
• Strong problem-solving skills and understanding of packaging trade-offs.
• Ability to work independently in a small, fast-paced engineering team.
• Experience with photonic design or optical modelling tools.
• Experience with reliability qualification and environmental testing.
• Experience working with foundries, substrate vendors or assembly partners.
• Knowledge of advanced packaging technologies, RF packaging or photonic interconnect systems.
• Startup or scale-up experience within photonics or semiconductor environments.

Aufgaben

• Own the packaging of photonic integrated circuits from prototype through to production-ready modules.
• Develop optical coupling solutions including fibre alignment, attachment and bonding processes.
• Define and optimise electrical interfaces including DC, RF and high-speed interconnect architectures.
• Support substrate and interposer selection across silicon, glass, ceramic and organic platforms.
• Develop scalable assembly and packaging processes suitable for pilot production.
• Perform optical characterisation, testing and failure analysis of packaged devices.
• Use experimental results to improve package performance, manufacturability and yield.
• Work closely with photonics, electronics and R&D teams to ensure packaging requirements are incorporated into product development.
• Collaborate with external assembly, substrate and foundry partners to deliver packaging solutions.

Kenntnisse

PIC packaging

Optical coupling

High-speed interfaces

Optical characterisation

Reliability testing

Packaging trade-offs

Independent work

Photonic modelling tools

Foundry collaboration

RF packaging

Startup/scale-up experience

Lab-to-production

Troubleshooting

Jobbeschreibung

IC Resources seeks a Senior Photonics Packaging Engineer to drive photonic integrated circuits from prototype to manufacturable products, delivering reliable optical, electrical and mechanical integration for next-generation PIC-based modules.

You will own the packaging program, develop fibre coupling and bonding processes, define high-speed interconnect architectures, select substrates, and collaborate closely with R&D, foundries and partners to scale production while optimizing yield and