Senior Photonics Packaging Engineer

IC Resources; København; Presencial; DKK 1 000 000 - 1 400 000; Tempo integral

Resumo da oferta

IC Resources seeks a Senior Photonics Packaging Engineer to drive photonic integrated circuits from prototype to manufacturable products, delivering reliable optical, electrical and mechanical integration for next-generation PIC-based modules.

You will own the packaging program, develop fibre coupling and bonding processes, define high-speed interconnect architectures, select substrates, and collaborate closely with R&D, foundries and partners to scale production while optimizing yield and

Qualificações

• 5+ years of photonics engineering with hands-on PIC packaging experience.
• Experience moving photonic packaging from lab prototypes to volume manufacturing.
• Strong understanding of optical coupling, alignment and attachment techniques.
• Knowledge of photonic assembly processes and packaging technologies.
• Experience with high-speed electrical interfaces, RF or optoelectronic integration.
• Ability to perform optical characterization and validation measurements.
• Strong problem-solving skills and understanding of packaging trade-offs.
• Ability to work independently in a small, fast-paced engineering team.
• Experience with photonic design or optical modelling tools.
• Experience with reliability qualification and environmental testing.
• Experience working with foundries, substrate vendors or assembly partners.
• Knowledge of advanced packaging technologies, RF packaging or photonic interconnect systems.
• Startup or scale-up experience within photonics or semiconductor environments.

Responsabilidades

• Own the packaging of photonic integrated circuits from prototype through to production-ready modules.
• Develop optical coupling solutions including fibre alignment, attachment and bonding processes.
• Define and optimise electrical interfaces including DC, RF and high-speed interconnect architectures.
• Support substrate and interposer selection across silicon, glass, ceramic and organic platforms.
• Develop scalable assembly and packaging processes suitable for pilot production.
• Perform optical characterisation, testing and failure analysis of packaged devices.
• Use experimental results to improve package performance, manufacturability and yield.
• Work closely with photonics, electronics and R&D teams to ensure packaging requirements are incorporated into product development.
• Collaborate with external assembly, substrate and foundry partners to deliver packaging solutions.

Conhecimentos

PIC packaging

Optical coupling

High-speed interfaces

Optical characterisation

Reliability testing

Packaging trade-offs

Independent work

Photonic modelling tools

Foundry collaboration

RF packaging

Startup/scale-up experience

Lab-to-production

Troubleshooting

Descrição da oferta de emprego

My client is looking for a Senior Photonics Packaging Engineer role, focused on taking photonic integrated circuits from prototype through to manufacturable products. Senior Photonics Packaging Engineer position covering optical, electrical and mechanical integration of advanced PICs.

This is an exciting opportunity within a fast-growing photonics company developing next-generation optical interconnect technologies, such as Quantum or AI applications.

Responsibilities

• Own the packaging of photonic integrated circuits from prototype through to production-ready modules
• Develop optical coupling solutions including fibre alignment, attachment and bonding processes
• Define and optimise electrical interfaces including DC, RF and high-speed interconnect architectures
• Support substrate and interposer selection across silicon, glass, ceramic and organic platforms
• Develop scalable assembly and packaging processes suitable for pilot production
• Perform optical characterisation, testing and failure analysis of packaged devices
• Use experimental results to improve package performance, manufacturability and yield
• Work closely with photonics, electronics and R&D teams to ensure packaging requirements are incorporated into product development
• Collaborate with external assembly, substrate and foundry partners to deliver packaging solutions

Requirements

• 5+ years experience in photonics engineering with strong hands-on PIC packaging experience
• Experience developing photonic packaging solutions from laboratory prototypes towards volume manufacture
• Strong understanding of optical coupling, alignment and attachment techniques
• Knowledge of photonic assembly processes and packaging technologies
• Experience with high-speed electrical interfaces, RF connectivity or optoelectronic integration
• Ability to perform and interpret optical characterisation and validation measurements
• Strong problem-solving skills and understanding of packaging trade-offs
• Ability to work independently within a small, fast-paced engineering team
• Experience with photonic design or optical modelling tools
• Experience with reliability qualification and environmental testing
• Experience working with foundries, substrate vendors or assembly partners
• Knowledge of advanced packaging technologies, RF packaging or photonic interconnect systems
• Startup or scale-up experience within photonics or semiconductor environments