(Sr.) Process Integration Engineer - Dry Etching GaN (m/f/d)

Nexperia Germany GmbH; Hamburg; On-site; EUR 65,000 - 90,000; Full time

Benefits offered by this job

Flexible working hours

Overtime reduction for work-life-balan

Employee benefits

Career development options

Retirement provisions

Travel allowance for public transport

Job summary

Arbeitsagentur is seeking a process engineer to develop wafer fab modules for GaN HEMT devices. You will lead integration and optimization projects, build technical knowledge, and engage in PC&O process improvement initiatives. A Masters in semiconductor technology and hands-on lithography experience are required.

Fluency in German and good English, plus strong communication skills, help drive cross-functional collaboration in a permanent, full-time role on site in Hamburg.

Qualifications

• Master's degree in a related field is required or highly preferred.
• Minimum 3 years of relevant experience depending on credentials.
• Knowledge of semiconductor devices and industrial semiconductor technology.
• Hands-on wafer fab process module development on lithography equipment.
• Team player with a strong drive to achieve success.
• Excellent German and good English language skills with strong communication.

Responsibilities

• Develop new wafer fab process modules on dry etching tools for GaN HEMT wafers.
• Execute process development or integration tasks and build product/process knowledge.
• Lead small or medium sized process integration or optimization projects.
• Serve as sub-project leader within complex projects.
• Build and maintain technical knowledge and internal/external contacts.
• Be an active member of PC&O process improvement teams.

Skills

German language fluency

English language proficiency

Team player

Strong communication

Hands-on wafer fab development

Education

Master's degree in Semiconductor Device Physics or Semiconductor Technology

Job description

What you will do

• Develop new wafer fab process modules on dry etching tools for GaN HEMT wafers (passivation, metal-etching, plasma clean)
• Execute process development or integration tasks and build up product and process knowledge
• Lead small or medium sized process integration or optimization projects
• Sub-project leader of process development or integration tasks in complex projects
• Build up and maintain knowledge (technical & procedures) and BG internal & external contacts in own field of expertise
• Be an active member in PC&O Process improvement teams

What you will need

• Masters' degree in Semiconductor Device Physics or Semiconductor Technology and/or Microelectronics
• Minimum 3 years of relevant experience depending on educational credentials
• Knowledge of semiconductor devices and industrial semiconductor technology
• Hands on experience in wafer fab process module developments on lithography equipment
• Team player with a strong drive to achieve success
• Fluency in German, good level of English
• Good communication skills, both verbal and written

Why work for us?

• Flexible working hours and possibility of overtime reduction to maintain a Work-Life-Balance
• Unlimited employment contract with a competitive salary and supplementary voluntary employee benefits
• A wide variety of training courses and career development options
• Numerous further benefits, such as retirement provisions, travel allowance for the public transport ticket, company events, sports and leisure activities, employee discounts and even more