Senior Microelectronic Design Engineer

Global Talent Alliance, Canada; Ottawa; On-site; CAD 110,000 - 160,000; Full time

Job summary

Global Talent Alliance seeks a Senior Microelectronic Design Engineer in Ottawa, Ontario. You will lead and execute advanced microelectronic packaging projects, from concept through volume manufacturing, in close collaboration with electrical, optical, and reliability engineering teams.

The role requires a strong background in electronic hardware packaging, multi-chip modules, RF/ microwave applications, and Cadence Allegro expertise, with a minimum of eight years in the field.

Qualifications

• Bachelor's degree in Mechanical Engineering or Physics with experience in electronic hardware design and packaging.
• Minimum 8 years of relevant industry experience.
• Proficient in CAD software and tools (AutoCAD, SolidWorks).
• Experience with packaging and substrate design software (Cadence Allegro).
• Background in microelectronic technologies, materials, components, manufacturing methods.

Responsibilities

• Lead product development in microelectronic design within a multidisciplinary team.
• Assess and select microelectronic technologies based on requirements.
• Design microelectronic packages and modules with thermal, mechanical, electrical considerations.
• Manage design documentation, BOMs, and ECO releases.
• Coordinate with manufacturers/suppliers for custom components.
• Oversee product verification to meet requirements.
• Support business development through proposals and quotations.
• Lead turnkey product development through to manufacturing.

Education

Bachelor's Degree in Mechanical Engineering or Physics

Tools

AutoCAD

SolidWorks

Cadence Allegro Package Designer Plus

FEA tools

Job description

About the job Senior Microelectronic Design Engineer

Job#81393

Job Purpose

The Microelectronic Design Engineering team, as part of our company'sGlobal Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design supported through its in depth background in materials technology, thermal, structural and reliability engineering.

We are seeking a Senior Microelectronic Design Engineer to join our team to support and lead both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases.

Nature of Duties/Responsibilities:

• Product development lead in microelectronic design and engineering as part of a multidisciplinary product development team, including electrical/RF engineering, optical engineering, reliability engineering, layout, documentation, manufacturing/process engineering and test engineering, in line with customer requirements and specifications.
• Industry assessment and selection microelectronic technologies and definition of design concepts, based on product applications, requirements and specifications.
• Engineering and design of microelectronic packages & modules, including integrating elements of material selections, substrate layout and designs, mechanical, thermal as well as incorporating key aspects of reliability, electrical (RF), optical, test and process engineering for volume manufacturing.
• Management of product documentation process including design specifications, drawings (piece parts, assembly, process) Bill of Materials, documentation release by engineering change order (ECO).
• Define specifications/requirements and coordinate/interface with manufacturers/suppliers for outsourced custom components.
• Oversee and support engineering product verification, ensuring compliance to product requirements.
• Drive business development initiatives including interfacing with potential and existing customers, preparation of marketing materials, proposals and quotations.
• Product management and lead of turnkey the product development process through to manufacturing implementation.

Education and Experience:

• Bachelors Degree in Mechanical Engineering, Physics, or other relevant degree with experience in electronic hardware design and packaging including multi-chip modules and semiconductor packaging for RF/Microwave/Optical applications.
• Minimum of 8 years of relevant industry experience.
• Proficient in computer aided design software and tools (AutoCad® SolidWorks®).
• Experience with commercial FEA tools and supporting analysis.
• Experience with packaging and substrate design software (Cadence® Allegro® Package Designer Plus).
• Background or relevant experience in microelectronic technologies, materials, components, manufacturing methods.
• Experience in end-to-end product development and manufacturing implementation.
• Security clearance is an asset.
• Customer focused with strong communication skills, and has the ability to work within a multidisciplinary product development team in a fast-paced and challenging environment.