Microelectronics Process Engineer

Global Talent Alliance, Canada; Ottawa; On-site; CAD 75,000 - 110,000; Full time

Job summary

Global Talent Alliance, Canada, is seeking a Microelectronics Process Engineer in Ottawa to develop and implement new processes for RF, optical and microelectronic components in a manufacturing setting. The role involves working with design teams, supporting NPI, and optimizing process performance across wafer-level assembly and packaging steps.

The ideal candidate holds a university engineering degree (mechanical or photonics preferred) with 2+ years in process or manufacturing engineering,

Qualifications

• Requires a university degree in Engineering (Mechanical or Photonics preferred).
• 2+ years' experience in a Process or Manufacturing Engineering support role.
• Experience with Optical and Microelectronic technologies and processes.
• Experience with wafer level processing (wafer level packaging, backend wafer processing) preferred.
• Hands-on build experience with bare dies or miniature components is an asset.
• Experience with equipment programming and assembly tooling is beneficial.

Responsibilities

• Collaborate with RF, optical, and microelectronic product teams to develop and implement new processes.
• Manage projects and timelines to meet milestones across customer projects.
• Provide process engineering solutions for new product development and NPI.
• Troubleshoot and analyze process performance; guide junior staff.
• Develop and document process assembly procedures and tooling requirements.
• Support lean manufacturing initiatives and DFx feedback to design teams.

Skills

Process engineering

Manufacturing engineering

Lean manufacturing

Problem solving

Team collaboration

Education

University degree in Engineering (Mechanical or Photonics preferred)

Tools

AutoCad/SolidWorks

MS Office

Job description

About the job Microelectronics Process Engineer

Job#80236

Job Purpose
The Microelectronics Process Engineer will manage, develop and implement new processes to be used in our manufacturing environment - embracing advanced RF, optical and microelectronic components, modules and sub-systems.

Nature of Duties / Responsibilities

• Work directly with RF, optical and microelectronic product design and development teams to provide process engineering solutions in support of new product development, with subsequent NPI and manufacturing support.


• Wafer level assembly experience would be an asset for this position.


• Supports new technology research and development pertaining to optical and microelectronic process solutions.


• Manages projects and timelines in order to meet milestones and deliverables of various customer projects.


• Application program on high end automated assembly equipment (dispensers, die bonders, wirebonders, optical aligners, etc.).


• Develops processes related to the assembly of Optical and Microelectronic modules, such as:
  
  
  
  • SMT + flip chip assembly (multi chip modules)
  
  
  • Flip chip underfill
  
  
  • Epoxy dispensing, high accuracy die bonding
  
  
  • Semiconductor die and microelectronic components bonding and interconnection (wirebond)
  
  
  • Packaging encapsulation
  
  
  • Optical active/passive alignment
  
  
  
  


• Troubleshoots and analyzes process performance problems. Provides technical guidance to less experienced team members.


• Conducts research into complex engineering problems to develop new operating policies, capabilities, and processes.


• Assists the Process Engineering team to deliver on accountabilities. Takes ownership for processes under his/her control.


• Creates process assembly documentation.


• Tooling and fixture design and procurement.


• Performs qualification on new processes being introduced.


• Implements and suggests engineering changes.


• Researches, procures, and accepts new pieces of equipment for continuously evolving technologies.


• Supports customer NPI builds within tight timelines.


• Provides DFx type feedback to the internal design team as well as external customers to help optimize manufacturability of products as well as increase yields and throughput.


• Education & Experience


• Requires a University degree in Engineering (Mechanical or Photonics preferred).


• 2+ years' experience in a Process or Manufacturing Engineering support role.


• Experience with Optical and Microelectronic technologies and processes.


• Experience with wafer level processing (wafer level packaging, backend wafer processing) would be preferred.


• Experience with AutoCad/SolidWorks.


• Hands-on build experience would be an asset (handling bare dies or miniature components with tweezers, use of microscopes, camera systems, etc.)


• Experience with equipment programming (auto dispensers, pick and place machines, welders, etc.) would be beneficial.


• Exposure to product design and development phases would be beneficial.


• A background in the execution of \"best practice\" process control is required.


• Experience with lean manufacturing principles.


• Experience with DFM and FMEA would be an asset.


• Experience with Microsoft Office Suite (Word, Excel, PowerPoint).