Senior Packaging Development Engineer

Nokia; Ottawa; On-site; CAD 90,000 - 120,000; Full time

Job summary

Nokia is seeking a Packaging Development Engineer to lead the development of next-generation packaging solutions for silicon photonics and high‑speed electronics. You will own all advanced packaging activities—from flip chip to wirebonding—and oversee production readiness with cross‑functional teams.

Responsibilities include optimizing assembly, maintaining documentation and BOMs, and supporting contract manufacturers to ensure a smooth transition to mass production.

Qualifications

• 5–8 years in high-speed electronics and silicon photonics packaging.
• Experience with flip chip, fanout, thermo‑compression bonding, underfill, hot bar soldering, wirebonding, die attach.
• Experience in microelectronics and optoelectronics packaging.
• Knowledge of materials properties and multilayer interfaces after bonding.
• Experience with high-volume packaging of optical transceivers and co-packaged optics.
• Proficient in documenting fabrication, inspection and assembly processes.
• Strong interpersonal and problem-solving skills to interact with vendors and contractors.

Responsibilities

• Lead next generation Silicon Photonics package design with cross-functional teams and vendors.
• Own all development of advanced packaging activities and designs: flip chip, reflow, fanout, underfill, wirebonding.
• Optimize assembly of electrical and optical engines for production volumes and cost targets.
• Survey advanced SiPh packaging solutions, materials and vendors for new tech.
• Maintain process and manufacturing documentation, including BOMs for new products.
• Drive package debugging during product validation and qualification.
• Support development activities at Contract Manufacturers, remotely and on-site for smooth mass production transition.

Skills

Silicon Photonics

High-speed electronics

Flip chip

Fanout

Thermo‑compression bonding

Wirebonding

Underfill

Die attach

Reflow

Metrology

Tools

SEM/XSEM

Confocal microscopy

Acoustic imaging

Job description

Job Description

Are you passionate about pushing the boundaries of optical package design? We're seeking a talented and driven Packaging Development Engineer to lead the development of next‑generation packaging solutions. In this role, you'll be at the forefront of innovation, collaborating with cross‑functional teams to optimize electrical assembly and RF signal efficiency and ensure seamless transition to mass production. If you're eager to own the design and development of flip chip, fan‑out, semiconductor dicing, and reflow processes, while staying abreast of cutting‑edge technologies, we encourage you to apply!

How You Will Contribute And What You Will Learn

• Lead next generation Silicon Photonics package design in collaboration with cross‑functional teams, stakeholders and vendors to ensure package requirements are met.
• Own all the development of all the advanced packaging activities and designs: flip chip, reflow, fanout, thermo‑compression bonding, underfill, hot bar soldering, wirebonding, etc.
• Optimize the assembly of electrical and optical engines and apply Design for Manufacturing principles to meet production volumes and cost targets.
• Survey advanced SiPh packaging solutions, materials and vendors to stay current with new technological advancements.
• Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
• Drive package debug activities during product validation and qualification.
• Support the development activities at our Contract Manufacturers, both remotely and on‑site to ensure a smooth transition to mass production.

Key Skills And Experience

You have:

• 5‑8 years of experience in high‑speed electronics and Silicon Photonics package design.
• Experience with flip chip, fanout, thermo‑compression bonding, underfill, hot bar soldering, wirebonding, die attach.
• Experience in microelectronics, optoelectronics packaging design and assembly.
• Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding.
• Experience in high‑volume packaging of optical transceivers, co‑packaged optics, multi‑chips module, pluggables, 2.5/3D packages.
• Experience with documentation of fabrication, inspection, and assembly processes.
• Solid interpersonal, communication and problem‑solving skills in order to interact with engineering staff, external vendors and contractors effectively.
• Experience with package and process design/development from design to production.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging – or equivalent practical work experience.

It would be nice if you also have:

• Familiar with optical coupling, fiber pigtail and free‑space optics.
• Knowledgeable in materials properties and process, yield analysis and enhancement, failure mode and analysis, quality tools (such as DOE, SPC and Six‑sigma process and analysis).
• Familiar with Industry Test Standard, such as JEDEC, EIA, Telcordia, Mil‑Std, etc.
• Knowledge of material properties and associated mechanical part fabrication processes.

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.