Senior Microelectronics Process Engineer

Sanmina; Ottawa; On-site; CAD 145,000 - 165,000; Full time

Job summary

Sanmina is seeking an industry expert to lead process architecture and development for optical and microelectronic solutions in Kanata, Ontario. The role involves defining assembly strategies, leading development of critical process recipes, and mentoring engineers.

With a Master’s Degree in Engineering and over 8 years of hands-on experience, candidates must possess deep expertise in Flip Chip and Wire Bonding processes. Join us for a chance to shape engineering culture while working on cutting-edge technologies.

Qualifications

• Minimum 8+ years of direct, hands-on experience in microelectronics packaging and process engineering.
• Deep expertise in Flip Chip and Wire Bonding processes is non-negotiable.
• Strong understanding of material interactions, including underfills, epoxies, and AuSn soldering/reflow processes.

Responsibilities

• Define comprehensive assembly strategies for complex optoelectronic modules.
• Lead hands-on development of critical process recipes.
• Implement robust process controls using PFMEA and Control Plans.
• Act as a subject matter expert and mentor to junior engineers.

Skills

Programming automated assembly equipment

Statistical process control (SPC)

Data analysis

Documentation and qualification reports

Mentoring engineers

Education

Master’s Degree in Engineering (Materials, Electrical, Mechanical, or Physics)

Tools

CAD tools (AutoCad, SolidWorks)

Job description

Advanced Microsystems Technologies (AMT) is a technology division of Sanmina Corporation, responsible for RF, microelectronic, optical components and integrated subsystems. We provide services from design concept through prototype testing, process development, assembly and test innovation, to volume manufacturing.

Job Purpose

We are seeking an industry expert to lead the process architecture and development for our next‑generation optical and microelectronic process solutions. In this pivotal role you will be the technical anchor for our product solutions team, defining assembly strategy from concept to release‑to‑manufacturing, bridging R&D and high‑volume manufacturing.

Key Responsibilities

Process Architecture & Development

• Define comprehensive assembly strategies for complex optoelectronic modules, aligning with device physics, thermal requirements, and throughput goals.
• Lead hands‑on development of critical process recipes, including Flip Chip, Underfill, Die Attach (epoxy & eutectic AuSn), and Wire Bonding (ball/wedge).
• Research, specify, and procure capital equipment; oversee acceptance testing (SAT/FAT) to ensure new capabilities meet technological roadmaps.

NPI & Design for Manufacturability (DFx)

• Act as the primary feedback loop to internal design teams and external customers, providing DFx guidance to optimize yield and reliability before prototypes are built.
• Conceptualize and drive the design of custom tooling and fixtures for novel assembly techniques.
• Serve as the primary technical liaison for customers during development, translating their requirements into viable manufacturing processes.

Quality, Analysis & Control

• Implement robust process controls using PFMEA and Control Plans.
• Lead complex troubleshooting efforts using methodical approaches (e.g., 8D) to resolve yield excursions or performance issues.
• Author and approve high‑level process assembly documentation and qualification reports.

Mentorship & Leadership

• Act as a subject matter expert and mentor to junior and intermediate engineers, fostering technical excellence.
• Manage engineering timelines and milestones to ensure customer NPI builds are delivered on schedule.

Required Experience & Education

• Master’s Degree in Engineering (Materials, Electrical, Mechanical, or Physics).
• Minimum 8+ years of direct, hands‑on experience in microelectronics packaging and process engineering.
• Deep expertise in Flip Chip and Wire Bonding (Chip & Wire) processes is non‑negotiable.
• Strong understanding of material interactions, including underfills, epoxies, and AuSn soldering/reflow processes.

Technical Skills

• Proficiency in programming automated assembly equipment (pick‑and‑place, dispensers, wire bonders).
• Demonstrated experience driving Engineering Change Orders (ECOs) and process qualifications.
• Strong background in statistical process control (SPC) and data analysis.

Preferred Assets

• Experience specifically within the Photonics/Microelectronics sector.
• Proficiency with CAD tools (AutoCad, SolidWorks) for tooling design.
• Knowledge of Lean Manufacturing and Six Sigma principles.

Why Join Us?

• Impact: Work on cutting‑edge technologies shaping the future of connectivity.
• Location: Based in the heart of Canada’s tech hub in Kanata, ON.
• Growth: Visible role with the opportunity to shape engineering culture and technical roadmap.

Other Information

• Compensation range: $145,000 - $165,000 annually.
• This position is for an existing vacancy.
• The hiring process for this position does not use Artificial Intelligence (AI).

Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.