Microelectronic Packaging Design Engineer

Global Talent Alliance, Canada; Ottawa; On-site; CAD 85,000 - 110,000; Full time

Job summary

Global Talent Alliance seeks a Microelectronic Packaging Design Engineer to join our Design Engineering team in Ottawa. You will lead the design of microelectronic modules and packaging concepts from concept through volume manufacturing, collaborating with electrical, RF, optical and mechanical engineers.

The role requires a solid background in wafer-level and chip-scale packaging, strong CAD skills (AutoCAD, SolidWorks) and experience with Cadence Allegro, plus familiarity with FEA tools for

Qualifications

• Bachelors degree with experience in electronic hardware design and packaging.
• Minimum of 5 years of relevant experience.
• Experience in Wafer Level Packaging (WLP) and Chip Scale Packaging (CSP).
• End-to-end product development and manufacturing implementation experience.
• Proficient in CAD software (AutoCAD, SolidWorks).
• Familiar with Cadence Allegro Package Designer Plus.
• Familiar with FEA software for thermal, structural and fatigue analysis.
• Security clearance is an asset.

Responsibilities

• Define and select microelectronic technologies and design concepts based on requirements.
• Design microelectronic modules and packaging including substrate layout and thermo-mechanical details.
• Collaborate with multidisciplinary teams across electrical/RF, optical, reliability and manufacturing for design to volume production.
• Create design specifications, drawings, BOM and ECO documentation.
• Coordinate with manufacturers/suppliers for outsourced components.
• Support product verification and interface with customers for proposals and quotations.

Skills

CAD tools

SolidWorks

Cadence Allegro

FEA analysis

Communication skills

Education

Bachelor's in Mechanical Engineering

Bachelor's in Physics

Tools

AutoCAD

SolidWorks

Cadence Allegro

FEA software

Job description

Microelectronic Packaging Design Engineer

About the job Microelectronic Packaging Design Engineer

Job#80142

Job Purpose

The Microelectronic Design Engineering team, as part of our company'sGlobal Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design supported through its in depth background in materials technology, thermal, structural and reliability engineering.

We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases.

Nature of Duties/Responsibilities:

• Selection and definition of microelectronic technologies and design concepts, based on product applications, requirements and specifications.
• Design of microelectronic modules, component and packages, including substrate layout and detailed designs integrating elements of material selections, mechanical and thermal design as well as incorporating key aspects of reliability, electrical (RF), optical, test and process engineering for volume manufacturing.
• Contribute to microelectronic design and engineering activities as part of a multidisciplinary product development team including electrical/RF engineering optical engineering, reliability engineering, layout, documentation, manufacturing/process engineering and test engineering, in line with customer requirements and specifications.
• Generate product documentation including design specifications, drawings (piece parts, assembly, process) Bill of Materials, documentation release by engineering change order (ECO).
• Define specifications/requirements and coordinate/interface with manufacturers/suppliers for outsourced custom components.
• Perform and support engineering product verification, ensuring compliance to product requirements.
• Support business development initiatives including interfacing with potential and existing customer, preparation of marketing materials, proposals and quotations.
• Support turnkey product development process through to manufacturing implementation.

Education and Experience:

• Bachelors Degree in Mechanical Engineering, Physics, or other relevant degree with experience in electronic hardware design and packaging including multi-chip modules and semiconductor packaging for RF/Microwave/Optical applications.
• Minimum of 5 years of relevant experience.
• Experience in Wafer Level Packaging (WLP) and Chip Scale Packaging (CSP).
• Background or relevant experience in microelectronic technologies, materials, components, manufacturing methods.
• Experience in end-to-end product development and manufacturing implementation.
• Proficient in computer aided design software and tools (AutoCad®, SolidWorks®).
• Familiar with packaging and substrate design software (Cadence® Allegro® Package Designer Plus).
• Familiar with commercial FEA software and tools in support of thermal, structural and fatigue (solder joint reliability) analysis.
• Security clearance is an asset.
• Customer focused with strong communication skills, and has the ability to work within a multidisciplinary product development team in a fast-paced and challenging environment.