Senior Microelectronic Packaging Engineer RF/Optical Modules

Global Talent Alliance, Canada; Ottawa; On-site; CAD 85,000 - 110,000; Full time

Job summary

Global Talent Alliance seeks a Microelectronic Packaging Design Engineer to join our Design Engineering team in Ottawa. You will lead the design of microelectronic modules and packaging concepts from concept through volume manufacturing, collaborating with electrical, RF, optical and mechanical engineers.

The role requires a solid background in wafer-level and chip-scale packaging, strong CAD skills (AutoCAD, SolidWorks) and experience with Cadence Allegro, plus familiarity with FEA tools for

Qualifications

• Bachelors degree with experience in electronic hardware design and packaging.
• Minimum of 5 years of relevant experience.
• Experience in Wafer Level Packaging (WLP) and Chip Scale Packaging (CSP).
• End-to-end product development and manufacturing implementation experience.
• Proficient in CAD software (AutoCAD, SolidWorks).
• Familiar with Cadence Allegro Package Designer Plus.
• Familiar with FEA software for thermal, structural and fatigue analysis.
• Security clearance is an asset.

Responsibilities

• Define and select microelectronic technologies and design concepts based on requirements.
• Design microelectronic modules and packaging including substrate layout and thermo-mechanical details.
• Collaborate with multidisciplinary teams across electrical/RF, optical, reliability and manufacturing for design to volume production.
• Create design specifications, drawings, BOM and ECO documentation.
• Coordinate with manufacturers/suppliers for outsourced components.
• Support product verification and interface with customers for proposals and quotations.

Skills

CAD tools

SolidWorks

Cadence Allegro

FEA analysis

Communication skills

Education

Bachelor's in Mechanical Engineering

Bachelor's in Physics

Tools

AutoCAD

SolidWorks

Cadence Allegro

FEA software

Job description

Global Talent Alliance seeks a Microelectronic Packaging Design Engineer to join our Design Engineering team in Ottawa. You will lead the design of microelectronic modules and packaging concepts from concept through volume manufacturing, collaborating with electrical, RF, optical and mechanical engineers.

The role requires a solid background in wafer-level and chip-scale packaging, strong CAD skills (AutoCAD, SolidWorks) and experience with Cadence Allegro, plus familiarity with FEA tools for