Senior Failure Analysis Engineer

Semtech; Burlington; On-site; CAD 80,000 - 110,000; Full time

Job summary

An established industry player is seeking a Senior Failure Analysis Engineer to join their team in Burlington. This role involves performing critical failure analysis on semiconductor products, generating detailed reports, and collaborating with various engineering teams to resolve issues. The ideal candidate will have extensive experience in semiconductor failure analysis and a strong background in engineering principles. This is an exciting opportunity to contribute to innovative technology in a dynamic and supportive environment, where your expertise will help shape the future of connected devices and systems.

Qualifications

• 7+ years of experience in semiconductor Failure Analysis.
• Hands-on experience with various FA equipment.
• Proficient in physical FA steps and electrical circuit analysis.

Responsibilities

• Perform die and package level failure analysis using various FA tools.
• Generate detailed FA reports for effective communication.
• Collaborate with engineering teams to identify root causes.

Skills

Semiconductor Failure Analysis

Electrical Circuit Analysis

Problem-Solving Skills

Communication Skills

Analytical Skills

Education

Bachelor’s degree in Engineering Physics

Bachelor’s degree in Electrical Engineering

Bachelor’s degree in Electronics Engineering

Tools

Curve Tracer

SEM/EDX

Scanning Acoustic Microscope

Photon Emission Microscope

Microprober

FIB X-sectioning

Job description

Join us as a Senior Failure Analysis Engineer at Semtech

Location: Burlington, ON (On-Site)

Semtech Corporation is a leading provider of high-performance semiconductors, IoT systems, and Cloud connectivity solutions. We are committed to delivering innovative technology that fosters a smarter, more connected, and sustainable world. Our global teams support solution architects and application developers in creating groundbreaking products for infrastructure, industrial, and consumer markets.

Responsibilities

• Perform die and package level failure analysis of customer and internal failures using various FA tools and techniques independently.
• Generate detailed FA reports for customers and internal teams to communicate findings effectively.
• Collaborate with engineering teams such as QA & Reliability, Design, Applications, Wafer Fabrication, Assembly, and Test Engineering to identify root causes and resolve issues.
• Contribute to the development of FA techniques, process improvements, and maintain laboratory supplies and equipment.

Minimum Qualifications

• Bachelor’s degree in Engineering Physics, Electrical, or Electronics Engineering.
• 7+ years of experience in semiconductor Failure Analysis, with additional expertise in Product Quality and Reliability, Test/Product Engineering, Design/Validation/Characterization, Applications, or Wafer Fabrication considered a plus.
• Hands-on experience with FA equipment such as Curve Tracer, SEM/EDX, Scanning Acoustic Microscope, Photon Emission Microscope, and Microprober. Experience with FIB X-sectioning and related techniques is advantageous.
• Proficiency in physical FA steps including decapsulation, lapping, cross-sectioning, and ion milling.
• Strong electrical circuit analysis, bench testing, and instrumentation skills.
• Knowledge of IC fabrication, semiconductor physics, BJT, and MOSFET theories.
• Excellent communication, analytical, problem-solving skills, and ability to work in a team.
• Proficient in MS Word, PowerPoint, and Excel.
• Willingness to work in a laboratory environment with flexible hours as needed.

Additional Information

• Seniority level: Mid-Senior level
• Employment type: Full-time
• Job function: Quality Assurance
• Industry: Semiconductor Manufacturing