Packaging Modeling & Thermal-Mechanics Engineer

onsemi; Southwestern Ontario; On-site; CAD 77,000 - 127,000; Full time

Job summary

onsemi in Waterloo, Ontario is seeking a driven modeling and simulation engineer for the Corporate R&D team. You will work on thermal-mech modeling for microelectronic packaging, addressing reliability and performance through advanced simulations and digital twin concepts.

The role focuses on developing state-of-the-art methodologies, maintaining the HW/SW environment, and collaborating across teams to solve thermal-mech challenges in power modules and products.

Qualifications

• Master or PhD in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials; PhD preferred.
• Knowledge and experience on thermal, mech modeling as well as crystal plasticity, and Cu/Ag sintering process.
• Knowledge and experience of CAD concepts and Solidworks.
• Familiar with semiconductor packaging.
• Familiar with material thermal mech properties.
• Strong knowledge of problem analysis and diagnosis technique.
• 2-3+ years of relevant experience.
• Deep knowledge of non-linear solid mechanics, fracture mechanics and delamination.
• Familiar with package test and analysis, quality assurance, and reliability methods.
• Ability to perform model correlation to empirical measurement.
• Familiar with the Unix/Linux operating system.
• Familiar with FEA software ANSYS Mechanical APDL/Work Bench.
• Strong English communication capability.
• Strong learning capability.
• Good team player.

Responsibilities

• Do thermal-mech simulation for microelectronic packaging and systems, incl. Ag/Cu sintering.
• Analyze reliability issues in existing packages caused by thermal problems.
• Correlate thermal-mech modeling results with measured data.
• Develop and maintain state-of-the-art thermal-mech modeling methodology.
• Set up and maintain HW/SW environment for thermal modeling.
• Provide support to other thermal-mech modeling users in the company.
• Innovate new technology through simulation.
• Develop advanced methods such as Digital Twin, AI/ML, crystal plasticity, and sintering models.

Skills

Thermal-mech modeling

Crystal plasticity

Cu/Ag sintering

SolidWorks

ANSYS Workbench

Semiconductor packaging

Unix/Linux

English communication

Teamwork

Learning ability

Education

Master's or PhD in Physics/Mechanical Engineering/Computational Mechanics/Materials

Tools

CAD concepts

SolidWorks

ANSYS Mechanical APDL

Job description

onsemi in Waterloo, Ontario is seeking a driven modeling and simulation engineer for the Corporate R&D team. You will work on thermal-mech modeling for microelectronic packaging, addressing reliability and performance through advanced simulations and digital twin concepts.

The role focuses on developing state-of-the-art methodologies, maintaining the HW/SW environment, and collaborating across teams to solve thermal-mech challenges in power modules and products.