Mechanical Engineer – Electronic Packaging

Morgan McKinley; Toronto; On-site; CAD 80,000 - 110,000; Full time

Job summary

Morgan McKinley is seeking a Mechanical Engineer to join our Etobicoke team, focusing on electronic packaging for space, avionics, and defense markets.

You will lead the design of enclosures, heat sinks, modules and related hardware, supporting prototype builds through production in a high-reliability environment.

Applicants should have a 4+ year background in electronic packaging and be adept with CAD/EM tools, with eligibility for CGP and ITAR clearance.

Qualifications

• Bachelor’s degree in Mechanical, Electrical, Aerospace, Mechatronics, Engineering Physics, or a related engineering discipline.
• 4+ years of experience in electronic packaging, product development, aerospace, defense, RF, or a related high-tech environment.
• Strong experience designing electronic/mechanical packaging solutions, including enclosures, housings, modules, or related hardware.
• Experience with Design for Manufacturability (DFM) and the transition of designs into production.
• Strong understanding of electronic packaging, thermal management, mechanical design, materials, and manufacturing processes.
• Experience with engineering and design tools such as SolidWorks, ANSYS HFSS, ANSYS Thermal/Mechanical, Altium Designer or Cadence Allegro, ADS, MATLAB, and SPICE.
• Experience with PCB-level packaging, RF assemblies, hermetic packaging, environmental qualification, or reliability engineering is an asset.
• Ability to work effectively with multidisciplinary mechanical, electrical, manufacturing, and test teams.
• Must be eligible to obtain CGP and ITAR clearance.

Responsibilities

• Lead electronic packaging design and development for space, aerospace, defense, and high-reliability products.
• Develop mechanical, thermal, structural, and electro-mechanical packaging solutions for RF and electronic assemblies.
• Perform requirements analysis, trade studies, tolerance analysis, thermal modeling, and structural assessments.
• Design enclosures, chassis, heat sinks, electronic modules, interconnects, and associated packaging hardware.
• Support prototype builds, environmental testing, qualification, and transition to production.
• Coordinate assembly, integration, verification, and failure investigations.
• Drive innovation, continuous improvement, manufacturability, and cost-effective packaging solutions.
• Provide project leadership from proposal through qualified product delivery, including technical, cost, and schedule accountability.
• Mentor engineers and technicians in packaging, manufacturing, and test best practices.

Skills

Mechanical design

Thermal management

RF packaging

Multidisciplinary teamwork

Education

Bachelor’s degree in Mechanical, Electrical, Aerospace, Mechatronics or related engineering

Tools

SolidWorks

ANSYS HFSS

ANSYS Thermal/Mechanical

Altium Designer

Cadence Allegro

ADS

MATLAB

SPICE

Job description

Mechanical Engineer – Electronic Packaging

Electronic / Mechanical Design | RF, Microwave, Aerospace & Defense

Etobicoke | Full-Time | On-Site

We are recruiting for an Electronic Packaging Engineer to join a growing manufacturing company in Etobicoke, supporting highly technical, high-reliability products across the space, avionics, and defense markets.

This is an electronic/mechanical packaging role — you will design the enclosures, chassis, modules, heat sinks, interconnects and other hardware that house and protect electronic and RF components.

You’ll take ownership of electronic packaging projects from concept through production, working closely with engineering and manufacturing teams and contributing to products designed for demanding environments, including space and aerospace applications.

What You’ll Do

• Lead electronic packaging design and development for space, aerospace, defense, and high-reliability products.
• Develop mechanical, thermal, structural, and electro-mechanical packaging solutions for RF and electronic assemblies.
• Perform requirements analysis, trade studies, tolerance analysis, thermal modeling, and structural assessments.
• Design enclosures, chassis, heat sinks, electronic modules, interconnects, and associated packaging hardware.
• Support prototype builds, environmental testing, qualification, and transition to production.
• Coordinate assembly, integration, verification, and failure investigations.
• Drive innovation, continuous improvement, manufacturability, and cost-effective packaging solutions.
• Provide project leadership from proposal through qualified product delivery, including technical, cost, and schedule accountability.
• Mentor engineers and technicians in packaging, manufacturing, and test best practices.

What We’re Looking For

• Bachelor’s degree in Mechanical, Electrical, Aerospace, Mechatronics, Engineering Physics, or a related engineering discipline.
• 4+ years of experience in electronic packaging, product development, aerospace, defense, RF, or a related high-tech environment.
• Strong experience designing electronic/mechanical packaging solutions, including enclosures, housings, modules, or related hardware.
• Experience with Design for Manufacturability (DFM) and the transition of designs into production.
• Strong understanding of electronic packaging, thermal management, mechanical design, materials, and manufacturing processes.
• Experience with engineering and design tools such as SolidWorks, ANSYS HFSS, ANSYS Thermal/Mechanical, Altium Designer or Cadence Allegro, ADS, MATLAB, and SPICE.
• Experience with PCB-level packaging, RF assemblies, hermetic packaging, environmental qualification, or reliability engineering is an asset.
• Ability to work effectively with multidisciplinary mechanical, electrical, manufacturing, and test teams.
• Must be eligible to obtain CGP and ITAR clearance.

Why Join?

• Work on advanced, high-reliability technology for space, aerospace, and defense applications.
• Take ownership of projects from concept through qualified product delivery.
• Work closely with both engineering and manufacturing teams in a hands-on environment.
• Help shape and grow the company’s electronic packaging engineering capabilities.