Engineer/Scientist packaging - R&D

Excelitas Technologies Corp.; Vaudreuil-Dorion; Hybrid; CAD 70,000 - 96,000; Full time

Job summary

Excelitas Technologies Corp. in Vaudreuil-Dorion, Quebec, is seeking a Packaging Engineer to lead the development of laser and photo-detector packages and to participate in the full product life cycle from design to production transfer.

You will work with product managers and application engineers, defining packaging solutions, evaluating prototypes, and supporting manufacturing to ensure performance and cost targets are met.

Qualifications

• Bachelor orMaster's degree in Mechanical, Electrical, Physics Engineering or equivalent.
• Proficiency with SolidWorks and ANSYS; electro-optical components knowledge is preferred.
• Strong data analysis skills and ability to work independently or in a team.
• Experience with reliability testing, quality control and technology transfer.

Responsibilities

• Create simulation models for thermal and stress analysis of packages.
• Define assembly and test jigs.
• Develop the assembly process and coordinate prototype assembly.
• Plan and conduct product evaluation and qualification against standards.
• Support transfer to production and supplier negotiations.
• Interact with product manager and application engineer on specifications and costing.
• Perform cost, time and feasibility analysis for quotes.
• Attend customer liaison meetings as required.
• Perform other related duties as required.

Skills

Bilingual (Fr/En)

Data analysis

Independent / team work

Multi-project management

Strong communication

Education

Bachelor/Master in Mechanical, Electrical or Physics Engineering

Tools

SolidWorks

ANSYS

Job description

Engineer/Scientist packaging - R&D

Location: Vaudreuil-Dorion, Quebec, CA, J7V-8P7

Job Function: Engineering R&D

Job Country: Canada

Job Type: Regular Full Time

Enable your future through light.

Excelitas is a global technology leader with more than 7,500 employees, focused on delivering market-driven solutions to fulfill the illumination, optical, detection and imaging needs of OEMs and end-users across the biomedical, semiconductor, industrial, consumer products, scientific, security, defense and aerospace sectors.

Engage with us today and make your contribution to the future! Join the team that leading technology companies turn to for cutting-edge photonic innovation. At Excelitas Technologies you are how we excel.

We are looking for a passionate Packaging Engineer who will participate in or lead the development of new semiconductor products, namely lasers and photo-detectors for commercial, industrial, automotive, medical, aerospace and defense applications. He (she) will be responsible for the packaging design and assembly process development of those products. He (she) will be involved in the full life cycle of the product, from design & development, transfer to production, and including ongoing engineering support for production and product management.

Your responsibilities:

• Create simulation models for the thermal and stress analysis of packages;
• Define assembly and test jigs;
• Participate to the development of the assembly process and coordinate the assembly of prototypes;
• Plan and conduct product evaluation and qualification for new and modified products against appropriate standards;
• Support the transfer to production of products;
• Negotiate specifications with suppliers;
• Interact with the product manager and application engineer on product definition, specifications and costing;
• Perform cost, time and feasibility analysis for quote request;
• Attend and participate in customer liaison meetings as required;
• Perform other related duties as required.
• Possess a Bachelor or master’s degree in Mechanical, Electrical, Pysics Engineering or equivalent;
• Be a member of the OIQ is an asset ;
• Be proficient with SolidWorks;
• Have knowledge of ANSYS;
• Have experience with electro-optical components;
• Having knowledge in electrical/electronic is an asset;
• Have experience of reliability testing and quality control;
• Have experience of technology transfer and related support documentation;
• Possess solid data analysis skills;
• Have the ability to work independently or within a team;
• Have the ability to work on multiple projects simultaneously;
• Have knowledge on TO, PCB, ceramic substrate and lead frame assembly technologies;
• Possess good communication skills and strong motivation are essential;
• Bilingualism written and spoken (French and English) in order to communicate with other Excelitas sites as well as with international customers.

Equal Opportunity/Affirmative Action Employer
Minorities/Females/Disability/Gender Identity/Sexual Orientation