Advanced Packaging Design Engineer

AttoTude inc.; Ottawa; On-site; CAD 90,000 - 130,000; Full time

Job summary

AttoTude inc. in Ottawa, ON is seeking an Advanced Packaging Engineer for a full-time, on-site role. You will design advanced packaging solutions, lead R&D initiatives, and collaborate with cross-functional teams and suppliers to ensure timely delivery of projects.

The role requires hands-on problem-solving and innovation in a rapidly evolving technical environment, covering architecture, detailed design, validation, and new product introduction.

Qualifications

• Experience in advanced silicon packaging, multichip module and high-speed interposer designs.
• Solid understanding of assembly process.
• Mechanical, thermal and FEA modeling and design experience.
• Proven track-record of product development from concept through volume production.
• Ability to work effectively in cross-disciplinary teams and drive technical collaborations.

Responsibilities

• Design advanced packaging solutions and architectures.
• Conduct R&D initiatives and validation activities.
• Collaborate with cross-functional teams and suppliers to meet deliverables.
• Manage project timelines and ensure on-time delivery.
• Support new product introductions and qualification activities.

Skills

Advanced packaging

Multichip module

Interposer design

Assembly process

FEA modeling

Thermal analysis

Cross-functional teamwork

Problem solving

Education

Master's degree in Mechanical Engineering

Job description

This is a full-time, on-site role located in Ottawa, ON, for an Advanced Packaging Engineer. The responsibilities include designing advanced packaging solutions, conducting research and development initiatives, collaborating with cross-functional teams and suppliers, and managing deliverables to ensure timely delivery. The role requires hands-on problem-solving and the ability to innovate in a rapidly evolving technical environment. Responsibilities range from architecture, detailed design, validation and new product introduction.

Qualifications

Experience in advanced silicon packaging,multichip module and high-speed interposer designs as well as solid understanding of assembly process.

Mechanical, thermal and FEA modeling and design experience.

Proven track-record of product development, from concept through volume production.

Ability to work effectively in cross-disciplinary teams and drive technical collaborations.

• Excellent analytical and problem-solving skills.
• Master’s degree or higher in Mechanical Engineering, Materials Science, or related field.