Semiconductor Packaging Modeling and Simulation Engineer

Socket.dev; Southwestern Ontario; On-site; CAD 90,000 - 120,000; Full time

Job summary

ON Semiconductor in Waterloo, Ontario seeks a self-driven professional to join the Corporate R&D modeling and simulation team as a packaging modeling and simulation engineer. You will support new power module development, product design, assembly, quality, reliability, and worldwide customers.

The role emphasizes thermal-mech modeling, correlation to empirical data, and development of advanced methods including Digital Twin and AI-driven approaches.

Qualifications

• Master or PhD in Physics, Mechanical Engineering, Computational Mechanics, or Materials.
• Experience in thermal and mechanical modeling with crystal plasticity and Cu/Ag sintering.
• Familiar with CAD concepts and SolidWorks; semiconductor packaging knowledge.

Responsibilities

• Do thermal-mech simulation for microelectronic packaging and system.
• Analyze reliability issues from thermal problems in existing packages.
• Correlate modeling results with measured data.
• Develop and maintain advanced thermal-mech modeling methods.
• Set up and maintain HW/SW environment for thermal modeling.
• Support other users in thermal-mech modeling across the company.
• Innovate with new technology via simulation (Digital Twin, AI/ML).

Skills

Thermal modeling

Mechanical modeling

Crystal plasticity

Cu/Ag sintering

CAD SolidWorks

Semiconductor packaging

FEA ANSYS

Unix/Linux

English communication

Problem analysis

Education

Master's or PhD in Physics/Engineering

Tools

ANSYS Mechanical APDL

ANSYS Workbench

SolidWorks

Job description

Job Summary:

ON Semiconductor is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, located in Waterloo, Ontario N2V 1KB, Canada. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.

Performance Objectives:

• Do thermal-mech simulation for microelectronic packaging and system, assembly process such as Ag sintering and Cu sintering
• Analyze existing packages of reliability issues that are induced by thermal problems.
• Do analysis and correlation of thermal mech modeling results to measured data
• Develop and maintain the state of art thermal mech modeling methodology to improve the modeling work efficiency and accuracy
• Setup and maintain the HW/SW environment for thermal modeling
• Provide support to other thermal mech modeling users in the company
• Innovation of new technology through simulation
• Develop the state of art simulation methodology such as Digital Twin, AI and machine learning algorithm, crystal plasticity model, Ag and Cu sintering model, probability and optimization algorithm for component and system level models

Requirements:

• Master or PhD degree in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials
• Knowledge and experience on thermal, mech modeling as well as crystal plasticity, and Cu/Ag sintering process
• Knowledge and experience of CAD concepts and Solidworks
• Familiar with semiconductor packaging
• Familiar with material thermal mech properties
• Strong knowledge of problem analysis and diagnosis technique
• Deep knowledge of non-linear solid mechanics, fracture mechanics and delamination
• Familiar with package test and analysis, quality assurance, and reliability methods
• Ability to perform model correlation to empirical measurement
• Familiar with the Unix/Linux operating system
• Familiar with FEA software ANSYS Mechanical APDL/Work Bench
• Strong English communication capability
• Strong learning capability