Semicon Process Integration Manager

People Profilers Pte Ltd; Região Norte; Presencial; BRL 180 000 - 260 000; Tempo integral

Resumo da oferta

People Profilers Pte Ltd is seeking an experienced Process Integration Manager to drive yield, quality, process stability, and productivity for wafer-related processes. You will lead process engineering teams, resolve defects, and oversee root cause analysis and corrective actions across manufacturing stages.

The role requires a degreed engineer with 10 years in wafer bumping, fabrication, or packaging, and strong knowledge of process integration and structured problem-solving methodologies.

Qualificações

• Degree in Engineering, Physics, Chemistry, Materials Science or related discipline.
• 10 years’ relevant experience in wafer bumping, wafer fabrication or semiconductor packaging.
• Strong knowledge of process integration, process stability, yield improvement and quality management.
• Experience in DOE, SPC and structured problem-solving is preferred.

Responsabilidades

• Lead and support process engineering teams in resolving defect, yield and process excursions.
• Drive root cause analysis, containment and corrective/preventive actions for quality issues and customer complaints.
• Analyse inline, electrical test and yield data to identify process weaknesses and improvement opportunities.
• Lead process improvement, DOE, SPC, 8D and 5-Why activities to enhance yield, quality and productivity.
• Support customer audits, process control plan updates and customer quality requirements.
• Lead new process/product qualification from design through low-volume manufacturing.

Conhecimentos

Yield improvement

Process integration

Quality management

Root cause analysis

Formação académica

Engineering/Physics/Chemistry/Materials Science degree

Ferramentas

DOE

SPC

8D

5-Why

Descrição da oferta de emprego

We are seeking an experienced Process Integration Manager to drive yield, quality, process stability and productivity for eWLB products.

Key Responsibilities

Lead and support process engineering teams in resolving defect, yield and process excursions.

Drive root cause analysis, containment and corrective/preventive actions for quality issues and customer complaints.

Analyse inline, electrical test and yield data to identify process weaknesses and improvement opportunities.

Lead process improvement, DOE, SPC, 8D and 5-Why activities to enhance yield, quality and productivity.

Support customer audits, process control plan updates and customer quality requirements.

Lead new process/product qualification from design through low-volume manufacturing.

Requirements

Degree in Engineering, Physics, Chemistry, Materials Science or related discipline.

10 years’ relevant experience in wafer bumping, wafer fabrication or semiconductor packaging.

Strong knowledge of process integration, process stability, yield improvement and quality management.

Experience in DOE, SPC and structured problem-solving is preferred.