Application / Process Engineer - Die Bond Tools

CAPCON LIMITED SINGAPORE BRANCH; Região Norte; Presencial; BRL 120 000 - 180 000; Tempo integral

Resumo da oferta

Capcon Limited Ltd. in Brazil North seeks an Applications/Process Engineer to advance die bonding software and hardware, analyze customer needs, and improve process performance. You will troubleshoot, calibrate equipment, and develop validation procedures while collaborating with R&D and manufacturing teams.

Willingness to travel for on-site support is required. Ideal candidates have 3+ years in semiconductor packaging, strong knowledge of advanced packaging, and hands-on experience with

Qualificações

• 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing.
• Strong knowledge of advanced packaging technologies such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
• Experience with semiconductor equipment integration, motion control systems, and process development.
• Hands-on troubleshooting and problem-solving in a high-tech manufacturing or lab environment.
• Excellent communication and ability to work independently and in cross-functional teams.

Responsabilidades

• Lead design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
• Analyze customer requirements and translate them into customized semiconductor packaging solutions.
• Troubleshoot and perform failure analysis of die attach tools, processes, and software anomalies.
• Perform machine setup, calibration, and alignment to ensure optimal performance and yield.
• Develop test procedures, application recipes, and documentation for process qualification and validation.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams.
• Provide on-site support for complex customer applications, including training and coaching.
• Serve as interface between customers and R&D to guide tool enhancements.

Conhecimentos

Semiconductor packaging

Die bonding equipment

Process development

Troubleshooting

Cross-functional collaboration

On-site support

Motion control systems

Formação académica

Bachelor’s or Master’s degree in Engineering

Ferramentas

Advanced packaging tech

Software/hardware integration

Descrição da oferta de emprego

Company Overview:

Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solutions powered by a world-class engineering team. Our product portfolio includes Flip-Chip Bonders, Chip-on-Wafer Bonders, Package-on-Package (PoP) Bonders, Stack Die Bonders, Panel-Level Die Bonders, and Multi-Chip Die Bonders, among others. We are committed to driving innovation in semiconductor backend processes to support emerging packaging architectures and heterogeneous integration.

Position Overview:

Capcon is seeking a highly motivated and skilled Application/Process Engineer to join our Advanced Control & Test (ACT) team. This role is instrumental in supporting the development, optimization, and deployment of advanced die bonding applications for next-generation semiconductor packaging. The successful candidate will work cross-functionally to improve software and hardware integration, conduct root cause analysis, enhance process capability, and provide hands‑on support to both internal teams and customers. This position requires a strong technical background, a proactive mindset, and a passion for driving technology adoption and continuous improvement in high-precision semiconductor equipment.

Key Responsibilities:

• Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
• Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on process optimization and application performance.
• Conduct troubleshooting and failure analysis of die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability.
• Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield.
• Develop test procedures, application recipes, and documentation for process qualification and validation; maintain detailed logs and technical reports.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address technical challenges and implement design or process improvements.
• Provide on-site support for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.
• Serve as a key interface between customers and the R&D team, delivering user feedback to guide tool enhancements and feature development.

Qualifications:

• Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
• 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
• Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
• Experience with semiconductor equipment integration, motion control systems, and process development.
• Hands‑on troubleshooting and problem‑solving skills in a high‑tech manufacturing or lab environment.
• Excellent communication and interpersonal skills; ability to work independently and in cross‑functional teams.
• Willingness to travel for customer support and on‑site installations (as required).