Semicon Equipment Senior /Engineer (CMP /TCB/Dicing/Cleaning)

People Profilers Pte Ltd; Região Norte; Presencial; BRL 180 000 - 300 000; Tempo integral

Vantagens oferecidas por esta oferta de emprego

Comprehensive benefits

Resumo da oferta

People Profilers Pte Ltd in Brazil seeks a seasoned Semiconductor Equipment Engineer to manage CoW and advanced packaging equipment such as TCB, Flip-Chip Bonder, CMP, Dicing, and wafer cleaning systems. Lead maintenance, troubleshooting, and uptime optimization; support new tool installation and calibrations.

Collaborate with Process, R&D, Manufacturing and Quality teams; manage vendors and drive reliability improvements.

Qualificações

• Experience operating CoW and advanced packaging equipment.
• Strong root-cause analysis and problem-solving skills.
• Ability to collaborate with cross-functional teams.
• Excellent communication abilities.

Responsabilidades

• Lead preventive maintenance and optimization to maximize uptime and yield.
• Support new tool installation, qualification, and calibration.
• Manage equipment vendors and escalations.
• Collaborate with Process, R&D, Manufacturing and Quality teams.

Conhecimentos

Semiconductor equipment

CoW packaging

Root-cause analysis

Downtime reduction

Formação académica

Bachelor’s degree in Mechanical, Electrical/Electronic, Materials Engineering

Ferramentas

TCB equipment

Flip-Chip Bonder

CMP

Dicing

Wafer cleaning

Descrição da oferta de emprego

Job:

Manage and maintain Chip-on-Wafer (CoW) and advanced packaging equipment, including TCB, Flip-Chip Bonder, CMP, Dicing, and wafer cleaning systems.

Lead preventive maintenance, troubleshooting, root-cause analysis, and equipment optimization to maximize uptime, OEE, and yield.

Support new tool installation, utility hook-up, qualification, buy-off, and sub-micron calibration.

Drive downtime reduction, spare-parts management, and equipment reliability improvements.

Collaborate with Process, R&D, Manufacturing, and Quality teams to resolve equipment and yield issues.

Manage equipment vendors, including technical specifications, modifications, upgrades, and escalations.

Requirement :

4–10+ years of semiconductor equipment engineering experience, preferably in CoW, 2.5D/3D packaging, TCB/FCB, or advanced flip-chip

Experience in TCB, Flip-Chip Bonder, CMP, Dicing, and wafer cleaning Equipment .

Bachelor’s degree in Mechanical, Electrical/Electronic, Materials Engineering, or equivalent industry experience, with strong communication skills

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.