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STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking a senior engineer to lead the NPI team, drive new product feasibility, characterization, and qualification, and coordinate with customers and TPM/PTM for build support.
You will manage engineering transfers from R&D to Operations, optimize eWLB technology, perform FMEA, DOE when required, and ensure an excursion-free ramp with timely NPIs and proper documentation.
Purpose of the Job (Why the job exists):
Lead team of NPI Staff/Senior/Engineers/Associate Engineers on:
New design reviews and checks against existing package design rules.
Supporting new product/customer feasibility build, characterization and qualifications.
Liaise with customers, TPM, PTM on engineering build support with regular conferences calls & meetings.
Undertake technology/project transfer from R&D to Operations.
Process optimization and improvements in eWLB technology.
Taking the lead for risk assessment, FMEA, optimization/DOE (if required) for new products.
Taking the lead in coordination with the various operation and support teams (mfg, process, equipment, mfg system, IE, CS etc) in preparing the line for new device startup/ramp. Ensure Excursion Free ramp.
Taking the lead for issues that arises from engineering builds.
Documentation of product eNPI phase/qual reports.
Supporting new customer engagement and fab visits.
Key Job Accountabilities (Actual daily deliverables):
Set up and track KPIs for department to ensure successful qualification.
Ensure timely delivery of all NPI lots.
Ensure excursion free ramp of all NPIs.
Train and develop team on Process Characterization Techniques using Statistical methods.
Liaise with R&D on technology transfers, new products.
Required Experience and Qualifications:
Requires B. Eng, B. Sc, M. Eng, M. Sc or PhD in Electrical, Electronics, Mechanical, Chemical Engineering, Physics, Material Science or its equivalent.
Minimum 5 years working experience in Wafer Fab or Bump Fab.
Minimum 3 years working at Management level.