R&D Singulation/Dicing Process Engineer

STATS CHIPPAC MANAGEMENT PTE. LTD.; Região Norte; On-site; BRL 150,000 - 230,000; Full time

Job summary

STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking an engineering professional to develop, optimize, and stabilize wafer/separation processes such as Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation.

You will drive process readiness, yield improvement, robustness, and customer-specific technical solutions toward production. The role requires 3–5 years of hands-on semiconductor process engineering, with a solid understanding of advanced fabrication and potential experience in

Qualifications

• 3–5 years of hands-on process engineering in semiconductor manufacturing.
• Fundamental understanding of advanced semiconductor fabrication and integration processes.
• Experience in Si Photonics applications, backgrinding, CMP, and planarization is an added advantage.

Responsibilities

• Develop and qualify separation processes for 2.5D, Fan-In, Fan-Out, and eBar technologies
• Lead DOE, process optimization, characterization, and continuous improvement using JMP
• Perform hands-on process setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment
• Drive process validation, yield stabilization, troubleshooting, and root-cause analysis
• Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support LVM readiness
• Provide technical support for customer programs, including feasibility evaluation and issue resolution
• Collaborate with cross-functional teams including R&D, Process Engineering, Equipment, Quality, and Operations to drive process qualification, technology transfer, and manufacturing readiness

Skills

Laser Grooving

Stealth Dicing

Blade Dicing

Molded Wafer Singulation

DOE

JMP

Education

Bachelor's degree in Engineering (Mechanical/Materials/Electronics)

Tools

JMP

DOE

Job description

About the role

Develop, optimize, and stabilize wafer/package separation processes, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation, for advanced semiconductor packaging. Drive process readiness, yield improvement, robustness, and customer-specific technical solutions toward production.

Key responsibilities

• Develop and qualify separation processes for 2.5D, Fan-In, Fan-Out, and eBar technologies
• Lead DOE, process optimization, characterization, and continuous improvement using statistical tools such as JMP
• Perform hands-on process setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment
• Drive process validation, yield stabilization, troubleshooting, and root-cause analysis
• Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support LVM readiness
• Provide technical support for customer programs, including feasibility evaluation and issue resolution
• Collaborate with cross-functional teams including R&D, Process Engineering, Equipment, Quality, and Operations to drive process qualification, technology transfer, and manufacturing readiness

About you

• Bachelor's degree in Engineering (Mechanical/Materials/Electronics)
• 3-5 years of hands-on experience in process engineering in semiconductor manufacturing
• Fundamental understanding of advanced semiconductor fabrication and integration processes
• Proficiency in preparing technical documentation and delivering presentations
• Experience in Si Photonics applications, backgrinding, CMP, and planarization is an added advantage