Semicon Equipment Senior/ Engineer

People Profilers Pte Ltd; Região Norte; Presencial; BRL 67 000 - 134 000; Tempo integral

Resumo da oferta

People Profilers Pte Ltd in Brazil is seeking a technically skilled equipment technician to sustain, troubleshoot, and improve wafer back-end operations. You will focus on OEE optimization, yield, quality, and productivity, partnering with engineers and production teams to resolve issues.

The role requires a Mechanical Engineering degree or equivalent and 2–5 years of relevant backend semiconductor experience, with a proactive, analytical problem-solving mindset.

Qualificações

• Degree/Diploma in Mechanical Engineering or equivalent.
• Minimum 2 years’ relevant experience in wafer bumping/backend semiconductor operations for degree holders, or 5 years for diploma holders.
• Strong equipment troubleshooting and process improvement skills.
• Knowledge of semiconductor backend equipment/processes is highly preferred.
• Proactive, analytical, and independent problem-solving mindset.

Responsabilidades

• Perform equipment setup, conversion, troubleshooting, repair, and production support.
• Minimize equipment downtime and maintain high OEE, utilization, and cycle-time performance.
• Identify and implement improvements to yield, quality, productivity, and manufacturing costs.
• Support backend processes including Die Pick & Place, Wafer Sorting, Underfill, Ball Drop, Reflow, Flux Cleaning, Taping/Detaping, Wafer Mounting, Wafer Saw, Open/Short Testing, and Wafer Probing.
• Collaborate with engineers, technical specialists, production teams, and equipment vendors to resolve technical issues.
• Drive machine modifications, design improvements, and continuous improvement initiatives.
• Provide technical guidance to junior team members.

Conhecimentos

Equipment troubleshooting

Process improvement

Problem solving

Formação académica

Mechanical Engineering or equivalent

Ferramentas

Wafer backend equipment

Descrição da oferta de emprego

The role focuses on equipment sustaining, troubleshooting, yield and quality improvement, OEE optimization, and productivity enhancement.

Key Responsibilities

• Perform equipment setup, conversion, troubleshooting, repair, and production support.
• Minimize equipment downtime and maintain high OEE, utilization, and cycle-time performance.
• Identify and implement improvements to yield, quality, productivity, and manufacturing costs.
• Support backend processes including Die Pick & Place, Wafer Sorting, Underfill, Ball Drop, Reflow, Flux Cleaning, Taping/Detaping, Wafer Mounting, Wafer Saw, Open/Short Testing, and Wafer Probing.
• Collaborate with engineers, technical specialists, production teams, and equipment vendors to resolve technical issues.
• Drive machine modifications, design improvements, and continuous improvement initiatives.
• Provide technical guidance to junior team members.

Requirements

• Degree/Diploma in Mechanical Engineering or equivalent.
• Minimum 2 years’ relevant experience in wafer bumping/backend semiconductor operations for degree holders, or 5 years for diploma holders.
• Strong equipment troubleshooting and process improvement skills.
• Knowledge of semiconductor backend equipment/processes is highly preferred.
• Proactive, analytical, and independent problem-solving mindset.

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.