Dry Etch Principal Engineer/ MTS Lead, Process Development, Advance NAND

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Região Norte; Sur place; BRL 600 000 - 950 000; Plein temps

Résumé du poste

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD seeks a Principal / MTS-Lead to drive dry etch process technology for next-generation NAND research and development. You will lead a team, coordinating with process integration, Wet etch, CVD, and other units to meet yield goals and schedule.

You will manage program strategy, mentor staff, and collaborate with manufacturing sites to align on requirements and timelines, while driving continuous improvement and AI-enabled efficiency initiatives.

Qualifications

• Minimum 5 years leading a process development team in semiconductor R&D or high-volume manufacturing.
• Comprehensive understanding of Plasma Dry Etch Technology.
• Experience in high aspect ratio etch development.
• Demonstrated structured problem-solving capabilities.

Responsabilités

• Manage efforts and set the strategy for developing process technology for assigned products in Process R&D.
• Offer routine project coordination and technical support to your process development team.
• Handle the demands of several customers to determine priorities for your team.
• Resolve yield and defect issues related to your process area.
• Collaborate with the Manufacturing Development Engineering team to meet R&D product quality and cycle time goals.
• Interact with equipment and chemical vendors to ensure alignment and timely progress on roadmaps.

Connaissances

Process leadership

Plasma dry etch

High-AR etch

AI tools adoption

Formation

PhD in Physics or Engineering

MS/BS with extensive semicon experience

Outils

AI-assisted tools

Description du poste

As a Principal / MTS-Lead, you will be a part of a groundbreaking next-generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration, and testing a new dimension and scaling with next generation NAND. You will collaborate directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & CMP. You will work on powerful and outstanding dry etch chambers & own the process roadmap to meet program and yield goals.

In this role, your responsibilities will include, but are not limited to:

Program and Project Management

• Manage efforts and set the strategy for developing process technology for assigned products in Process R&D.

• Offer routine project coordination and technical support to your process development team.

• Handle the demands of several customers to determine priorities for your team.

• Resolve yield and defect issues related to your process area.

• Collaborate with the Manufacturing Development Engineering team to meet R&D product quality and cycle time goals.

• Work with R&D Management, Process Integration, and High-Volume Manufacturing Sites to regularly align on project requirements, priorities, and timelines.

• Engage manufacturing sites, Manufacturing Integration, and Central Teams to provide technical direction and maintain alignment between production and R&D.

• Drive ongoing process and operational efficiency improvements to meet the needs of PI and manufacturing by actively interacting with the equipment development team and suppliers.

• Interact with equipment and chemical vendors to ensure alignment and timely progress on our roadmaps, as well as foster a positive relationship.

Performance Management

• Partner with direct reports to develop long/short-term goals and projects that meet the needs of the Technology Development department.

• Offer ongoing feedback to your team members on performance, establishing a career plan and mentoring your team members to encourage their professional development.

• Set and communicate performance goals for the team, and lead goal-based performance evaluations for all team members.

• Mentor team members on technical as well as soft skills (presentation skills, risk management, decision making, vendor interaction, etc.)

• Recognize and reward Micron team members for outstanding performance.

• Recruit both external and internal candidates to fill headcount in the group.

• Provide conflict resolution if issues arise.

Requirements

• At least five years of experience leading a process development team in a semiconductor R&D or high-volume manufacturing environment.

• Comprehensive understanding of Plasma Dry Etch Technology.

• Knowledge and experience in high aspect ratio etch development.

• Demonstration of collaborative ways of problem solving.

• Understand hard mask requirements based on material properties.

• Positive relationship building skills, both with internal and external customers.

• Demonstrated structured problem-solving capabilities.

• Strong communication and interpersonal skills (written, verbal, and presentation).

• Experience in being a mentor to manage the performance of direct reports.

• Ability to seek opportunities for continuous improvement, as a team member, leader, and for the organization.

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
  

Education

• PhD or Masters in Physics, Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, along with at least 8 years of experience in the semiconductor industry concentrating on dry etch technology and managing personnel.

• Bachelor's degree in Physics, Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, along with at least 15 years of experience in the semiconductor sector concentrating on Dry Etch technology and managing personnel.