Physical Failure Analysis (PFA) Technician

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Região Norte; On-site; BRL 67,000 - 100,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD seeks a capable failure analysis technician to perform electrical and physical FA on advanced packaging products. You will prepare samples, operate SEM/EDX, FIB, X-ray, and C-SAM, and document findings with clear FA reports.

Ideal candidates have 1–2 years in semiconductor FA, hands-on tool experience, and a strong safety mindset. You will work with cross-functional teams to improve lab performance and turnaround times.

Qualifications

• Minimum NITEC, Higher NITEC or Diploma in Engineering or equivalent.
• Minimum 1-2 years of working experience in semiconductor failure analysis.
• Hands-on experience with SEM/EDX, FIB, X-ray, C-SAM, and sample prep tools.
• Fundamental knowledge of semiconductor wafer fabrication, and advanced packaging processes.
• Self-motivated, proactive, and able to communicate effectively with stakeholders at all levels.
• Ability to work independently as well as collaboratively with other teams.
• Proficient in Microsoft Office applications and technical report preparation.
• Commitment to safety, quality, and continuous improvement.

Responsibilities

• Perform electrical and physical failure analysis on advanced packaging products to identify defects and root causes.
• Prepare samples, cross-sections, decapsulation, polishing, and microscopy for FA investigations.
• Operate and maintain analytical equipment such as Optical Microscopes, SEM, EDX, FIB, X-ray, C-SAM, and other FA tools.
• Write FA reports documenting findings in a timely manner.
• Ensure compliance with laboratory safety, SOPs, quality management systems, and 6S housekeeping.
• Participate in continuous improvement to enhance laboratory efficiency, analytical capability, and turnaround time.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one scope of work.

Skills

Failure analysis

Root cause analysis

Analytical thinking

Communication

Education

NITEC / Higher NITEC or Diploma in Engineering

Tools

SEM/EDX

FIB

X-ray

C-SAM

Optical Microscopes

Job description

Job Responsibilities

• Perform electrical and physical failure analysis on advanced packaging products to identify root causes of defects and failures using advanced failure analysis tools.

• Perform sample preparation, cross-sectioning, decapsulation, polishing, microscopy inspection, and other laboratory techniques as required for failure analysis investigations.

• Operate and maintain analytical equipment such as Optical Microscopes, SEM, EDX, FIB, X-ray, C-SAM, and other failure analysis tools.

• Write and document failure analysis findings, and FA reports in a timely manner.

• Ensure compliance with laboratory safety requirements, equipment operating procedures, quality management systems, and 6S housekeeping rules.

• Participate in continuous improvement initiatives to enhance laboratory efficiency, analytical capability, and turnaround time.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

Qualifications and Work Experience

• Minimum NITEC, Higher NITEC or Diploma in Engineering or equivalent.

• Minimum 1-2 years of working experience in semiconductor failure analysis.

• Hands-on experience with SEM/EDX, FIB, X-ray,C-SAM, and sample prep tools.

• Fundamental knowledge of semiconductor wafer fabrication, and advanced packaging processes.

• Self-motivated, proactive, and able to communicate effectively with stakeholders at all levels.

• Ability to work independently as well as collaboratively with other teams.

• Proficient in Microsoft Office applications and technical report preparation.

• Commitment to safety, quality, and continuous improvement.