X-ray Metrology for Micron-thick Multilayer 3D-DRAM

Imec; Vlaams-Brabant; On-site; EUR 12,000 - 18,000; Full time

Job summary

Imec invites a Master student to join our metrology team for an internship focused on advanced X-ray techniques to characterize micron-thick multilayer stacks used in future memory devices. You will work with XRR, HR-XRD, GISAXS and diffuse scattering to quantify layer thickness, periodicity and interface quality, benchmarking against TEM.

The project includes analyzing spectra from ONO and Si/SiGe samples, exploring correlations between growth, morphology, and 3D memory scaling.

Qualifications

• Background in physics, materials science, nanotechnology, or related field.
• Interest in experimental work, data analysis and theoretical interpretation.
• Analytical, meticulous, and comfortable with mathematical concepts.

Responsibilities

• Develop advanced X-ray characterization techniques to study thick multilayer stacks.
• Analyze lab-scale X-ray spectra from ONO and Si/SiGe samples.
• Interpret spectra and correlate with layer thickness and interfaces.
• Collect complementary spectra during synchrotron beamtime and interpret results.

Skills

Analytical

Attention to detail

Data analysis

Education

Physics

Nanoscience & Nanotechnology

Materials Engineering

Tools

X-ray instrumentation

Scientific programming

Job description

Imec invites a Master student to join our metrology team for an internship focused on advanced X-ray techniques to characterize micron-thick multilayer stacks used in future memory devices. You will work with XRR, HR-XRD, GISAXS and diffuse scattering to quantify layer thickness, periodicity and interface quality, benchmarking against TEM.

The project includes analyzing spectra from ONO and Si/SiGe samples, exploring correlations between growth, morphology, and 3D memory scaling.