Laser-Driven Light–Matter Modeling for Temporary Bonding

Imec; Vlaams-Brabant; Remote; USD 12,742 - 17,839; Full time

Job summary

Imec invites applications for a Master internship in Leuven focused on modelling light-matter interaction for temporary bonding. The project targets improved heat-based debonding of wafer stacks and involves simulating laser absorption and temperature dynamics to optimize release conditions.

The internship is for 6 months with activities closely tied to semiconductor process integration and device fabrication workflows.

Qualifications

• Enrolled in a Master program in Materials Engineering, Physics, Nanoscience or Nanotechnology.
• Strong analytical and modeling skills.
• Interest in semiconductor process integration.

Responsibilities

• Model the interaction between infrared laser light and debonding stack to support heat-based debonding.
• Simulate laser absorption, predict temperature evolution, and identify process conditions for reliable, selective release of the device wafer.
• Guide the development of a robust and efficient laser-assisted temporary bonding approach.

Skills

Analytical skills

Modeling skills

Semiconductor know-how

Education

Master program in Materials Engineering, Physics, Nanoscience or Nanotechnology

Job description

/ Modelisation of light matter interaction for temporary bonding applications

Modelisation of light matter interaction for temporary bonding applications

As the semiconductor industry pivots from traditional node scaling toward system-level innovation, temporary bonding and debonding of wafers is a key steps for next industrial development. In this internship the goal is to explore the potential improvement of an advanced technique enabling the use of standard Si wafers as temporary carriers.

Type of internship: Master internship

Duration: 6 months

Required educational background: Materials Engineering, Physics, Nanoscience & Nanotechnology

University promotor: Clement Merckling (KU Leuven)

The reference code for this position is 2026-INT-147. Mention this reference code in your application.

Imec allowance will be provided for students studying at a non-Belgian university.

Applications should include the following information:

• resume
• motivation
• current study

As the semiconductor industry shifts toward advanced system‑level integration, temporary wafer bonding and debonding has become essential for handling thin wafers and complex packaging flows. This internship focuses on improving a technique that enables the use of standard Si wafers as temporary carriers, offering a low‑cost and process‑friendly solution.

The main objective is to model the interaction between infrared laser light and debonding stacj to support heat‑based debonding. The work will involve simulating laser absorption, predicting temperature evolution, and identifying process conditions that allow reliable, selective release of the device wafer. The results will guide the development of a robust and efficient laser‑assisted temporary bonding approach.

Type of internship: Master internship

Duration: 6 months

Required educational background: Materials Engineering, Physics, Nanoscience & Nanotechnology

University promotor: Clement Merckling (KU Leuven)

Supervising scientist(s): For further information or for application, please contact Francois Chancerel ( [e-mail] ) and John Slabbekoorn ( [e-mail] )

The reference code for this position is 2026-INT-147. Mention this reference code in your application.

Imec allowance will be provided for students studying at a non-Belgian university.

Applications should include the following information:

• resume
• motivation
• current study

Incomplete applications will not be considered.

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