Master Internship: Voiding in Wafer Bonding (Schlieren)

Imec; Vlaams-Brabant; Sur place; EUR 13 000 - 20 000; Plein temps

Résumé du poste

Imec in Belgium invites applications for a Master internship on the mechanics and characterisation of voiding in wafer-wafer bonding using synthetic Schlieren. The project combines experimental measurements with heavy data analysis and some analytical modelling, supervised by Prof Pierre-Thomas Brun at KU Leuven.

The internship focuses on visualizing parasitic void-tail formation with high-speed imaging and quantifying the mechanical parameters governing void growth during bonding.

Qualifications

• Master internship in Physics or Mechanical Engineering.
• Strong data analysis and experimental skills required.
• Experience with high-speed imaging is a plus.

Responsabilités

• Conduct experimental measurements to quantify voiding in wafer-wafer bonding.
• Analyze data and develop analytical models of void formation.
• Visualize void-tail formation using high-speed imaging.
• Coordinate with KU Leuven supervisor and imec team.

Connaissances

Data analysis

Experimental measurements

Analytical modelling

High-speed imaging

Formation

Master in Physics

Master in Mechanical Engineering

Description du poste

Imec in Belgium invites applications for a Master internship on the mechanics and characterisation of voiding in wafer-wafer bonding using synthetic Schlieren. The project combines experimental measurements with heavy data analysis and some analytical modelling, supervised by Prof Pierre-Thomas Brun at KU Leuven.

The internship focuses on visualizing parasitic void-tail formation with high-speed imaging and quantifying the mechanical parameters governing void growth during bonding.