Metal Interfaces for 3D Wafer Bonding Internship

Imec; Vlaams-Brabant; On-site; EUR 8,900 - 12,000; Part time

Job summary

Imec invites Master or PhD interns to investigate how different surface pretreatments influence metallic surfaces for advanced 3D wafer stacking. You will design and perform experiments, analyze surface evolution, and assess bonding stability of interfaces to guide scalable processes for future 3D integration technologies.

The project aims to deepen understanding of surface preparation and bonding reliability, contributing to robust, scalable wafer bonding for diverse materials.

Qualifications

• Master or PhD internship available.
• Reference code 2026-INT-318 to be mentioned in application.
• Knowledge of surface pretreatments and bonding processes preferred.

Responsibilities

• Define and execute an experimental study on how surface pretreatments affect metallic surfaces.
• Characterize surface evolution after pretreatment.
• Evaluate stability and bonding performance of interfaces in 3D wafer bonding.
• Combine surface-analysis techniques with structured data interpretation to identify promising treatment strategies.

Skills

experimental design

data interpretation

Education

Chemistry/Chemical Engineering

Materials Engineering

Nanoscience & Nanotechnology

Job description

Imec invites Master or PhD interns to investigate how different surface pretreatments influence metallic surfaces for advanced 3D wafer stacking. You will design and perform experiments, analyze surface evolution, and assess bonding stability of interfaces to guide scalable processes for future 3D integration technologies.

The project aims to deepen understanding of surface preparation and bonding reliability, contributing to robust, scalable wafer bonding for diverse materials.