Wafer-to-Wafer 3D Bonding Reliability — Master Internship

Imec; Vlaams-Brabant; On-site; EUR 8,900 - 13,000; Full time

Job summary

imec, based at Leuven, Belgium, invites Master interns to study the reliability of wafer-to-wafer hybrid-bonding, focusing on SiCN dielectric materials. The role involves data collection, preparation and analysis, and developing a lifetime model for reliability under various conditions.

Supervising scientist Emmanuel Chery will guide the project. Duration is 4–6 months for self-supported students, with direct application contact provided.

Qualifications

• Master student in Materials Engineering or Physics.
• Internship duration 4–6 months.
• Based at imec Leuven, Belgium.

Responsibilities

• Data collection and analysis of SiCN dielectric reliability.
• Data preparation and data analyses for reliability study.
• Develop a lifetime model to estimate maximum use voltage and temperature for various profiles.

Education

Materials Engineering

Physics

Job description

imec, based at Leuven, Belgium, invites Master interns to study the reliability of wafer-to-wafer hybrid-bonding, focusing on SiCN dielectric materials. The role involves data collection, preparation and analysis, and developing a lifetime model for reliability under various conditions.

Supervising scientist Emmanuel Chery will guide the project. Duration is 4–6 months for self-supported students, with direct application contact provided.