Wafer Process Engineer - SPC, Ownership and Optimization

ams-OSRAM AG; Unterpremstätten; Vor Ort; EUR 52.000 - 68.000; Vollzeit

Zusammenfassung

ams-OSRAM AG in Austria is seeking a technically skilled professional for single process ownership in mechanical wafer processing such as backgrinding, temporary/permanent bonding, sawing and debonding. You will maintain process performance using SPC and FDC, and support in-house production objectives.

The role requires HTL-level education in a technical field, basic quality knowledge, ownership mindset, and collaboration in cross-functional teams.

Qualifikationen

• Finished education in a technical field (HTL preferred)
• Basic quality requirements knowledge (5S, etc.)
• Taking ownership, pro-active and independent
• Working in technical and cross-functional teams
• Excellent technical and analytical skills
• Availability for weekend shifts
• Very good communication in German and English

Aufgaben

• Single process ownership in mechanical wafer processing (backgrinding, bonding, sawing, debonding)
• Maintain process performance using SPC, FDC
• Support productivity goals of in-house production
• (re-) qualification of single processes
• Maintain related controlled documents (control plan, FMEA, WSP)
• Gain and improve in-depth single process knowledge
• Support single process development
• Identify and drive single process improvements

Kenntnisse

Ownership

SPC

FDC

Documentation

Cross-functional

Ausbildung

HTL (Higher Technical College)

Jobbeschreibung

ams-OSRAM AG in Austria is seeking a technically skilled professional for single process ownership in mechanical wafer processing such as backgrinding, temporary/permanent bonding, sawing and debonding. You will maintain process performance using SPC and FDC, and support in-house production objectives.

The role requires HTL-level education in a technical field, basic quality knowledge, ownership mindset, and collaboration in cross-functional teams.