MWP Process Engineer (d/m/f)

ams-OSRAM AG; Unterpremstätten; Vor Ort; EUR 52.000 - 68.000; Vollzeit

Zusammenfassung

ams-OSRAM AG in Austria is seeking a technically skilled professional for single process ownership in mechanical wafer processing such as backgrinding, temporary/permanent bonding, sawing and debonding. You will maintain process performance using SPC and FDC, and support in-house production objectives.

The role requires HTL-level education in a technical field, basic quality knowledge, ownership mindset, and collaboration in cross-functional teams.

Qualifikationen

• Finished education in a technical field (HTL preferred)
• Basic quality requirements knowledge (5S, etc.)
• Taking ownership, pro-active and independent
• Working in technical and cross-functional teams
• Excellent technical and analytical skills
• Availability for weekend shifts
• Very good communication in German and English

Aufgaben

• Single process ownership in mechanical wafer processing (backgrinding, bonding, sawing, debonding)
• Maintain process performance using SPC, FDC
• Support productivity goals of in-house production
• (re-) qualification of single processes
• Maintain related controlled documents (control plan, FMEA, WSP)
• Gain and improve in-depth single process knowledge
• Support single process development
• Identify and drive single process improvements

Kenntnisse

Ownership

SPC

FDC

Documentation

Cross-functional

Ausbildung

HTL (Higher Technical College)

Jobbeschreibung

Requisition ID24158-Posted08/24/2026

The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends.
Find out more about us on https://ams-osram.com

Your new responsibilities

• Single process ownership in the area of mechanical wafer processing – such as backgrinding, temporary/permanent bonding, sawing and debonding
• Maintain single process performance by applying statistical process control (SPC), fault detection & classification (FDC), etc.
• Support productivity goals of our in-house production
• (re-) qualification of single processes
• Maintain related controlled documents - e.g., control plan; Failure Mode and Effects Analysis (FMEA), Workstation Procedure (WSP); etc. & general documentation
• Gain and further improve in-depth single process knowledge
• Support of single process development
• Identify and drive single process improvements

Who we are looking for

• Finished education in a technical field, such as physics, chemistry, process technology, etc. (minimum requirement: “HTL (higher technical college)”; higher academical grades appreciated)
• Understanding of basic quality requirements (5S, etc.)
• Taking ownership, working pro-actively & independent
• Working in technical and cross-functional teams
• Excellent technical & analytical skills
• Availability for weekend shifts
• Very good communication skills in German and English

We offer competitive salaries and additional benefits based on your performance, experience and qualification.