MWP Process Engineer (d/m/f) - temporary until 31.07.2028

Ams Osram; Österreich; Vor Ort; EUR 45.000 - 65.000; Vollzeit

Zusammenfassung

ams OSRAM, a leading unit in advanced photonics, seeks a skilled engineer to own a single mechanical wafer process. You will apply SPC and FDC to maintain process performance and support in-house production while qualifying and improving processes. Strong German and English communication are required, and weekend shifts may occur.

The role requires HTL or higher technical education, basic 5S knowledge, and a proactive, independent mindset within cross-functional teams.

Qualifikationen

• Finished education in a technical field (HTL or higher).
• Understanding of basic quality requirements (5S).
• Taking ownership, pro-active & independent.
• Willingness for weekend shifts.
• Very good communication in German and English.

Aufgaben

• Own single process in mechanical wafer processing – backgrinding, bonding, sawing and debonding.
• Maintain single process performance with SPC, FDC, etc.
• Support productivity goals of our in-house production.
• (re-) qualification of single processes.
• Maintain related controlled documents (control plan; FMEA; WSP).
• Gain and further improve in-depth single process knowledge.
• Identify and drive single process improvements.

Kenntnisse

Process ownership

SPC

FMEA

Documentation

Cross-functional teamwork

Ausbildung

HTL (higher technical college)

Jobbeschreibung

We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centres, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.

• Single process ownership in the area of mechanical wafer processing – such as backgrinding, temporary/permanent bonding, sawing and debonding
• Maintain single process performance by applying statistical process control (SPC), fault detection & classification (FDC), etc.
• Support productivity goals of our in‑house production
• (re‑) qualification of single processes
• Maintain related controlled documents - e.g., control plan; Failure Mode and Effects Analysis (FMEA), Workstation Procedure (WSP); etc. & general documentation
• Gain and further improve in‑depth single process knowledge
• Support of single process development
• Identify and drive single process improvements

• Finished education in a technical field, such as physics, chemistry, process technology, etc. (minimum requirement: “HTL (higher technical college)”; higher academical grades appreciated)
• Understanding of basic quality requirements (5S, etc.)
• Taking ownership, working pro-actively & independent
• Working in technical and cross‑functional teams
• Excellent technical & analytical skills
• Availability for weekend shifts
• Very good communication skills in German and English
  

We offer competitive salaries and additional benefits based on your performance, experience and qualification.

The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group F (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
We offer a higher compensation depending on your expertise and skills.