Staff Engineer — 3D IC Process Development Lead

ams-OSRAM AG; Unterpremstätten; Vor Ort; EUR 70.000 - 100.000; Vollzeit

Zusammenfassung

ams-OSRAM AG is seeking an advanced degree holder to develop manufacturing process modules in collaboration with internal and external fabs, driving 3D integration concepts and TSV development.

You will lead projects or work packages, perform experiments, analyze data, and document results, while maintaining high quality and timely execution. Proficient English is required for reporting and collaboration.

Qualifikationen

• Advanced university degree (Master’s or PhD) in Physics, Chemistry, or a related field.
• Strong understanding of Through Silicon Vias (TSVs) for process module development and industrialization.
• Experience with Wafer-to-Wafer bonding and Die-to-Wafer stacking for 3D integration concepts.
• Proven team player with excellent collaboration skills.
• Proficient in English, written and spoken, with structured reporting.

Aufgaben

• Develop manufacturing process modules in collaboration with internal and external Fabs, from concept design through implementation.
• Take ownership of projects or work packages depending on project size and lead sub-teams.
• Definition, implementation, analysis and documentation of experiments.
• Solve problems during process development and make technical decisions within projects.
• Collaborate in a team-oriented environment with emphasis on quality, timely project execution and documentation.
• Lead material/technology characterization during development and compile data-driven reports.
• Apply risk assessment techniques (e.g., FMEA) and mitigate risks for successful project completion and handover to production.
• Propose innovative process and device concepts contributing to IP portfolio via patent submissions.

Kenntnisse

TSV expertise

3D integration

Team collaboration

English proficiency

Ausbildung

Master's or PhD in Physics, Chemistry, or related

Tools

FMEA

Jobbeschreibung

ams-OSRAM AG is seeking an advanced degree holder to develop manufacturing process modules in collaboration with internal and external fabs, driving 3D integration concepts and TSV development.

You will lead projects or work packages, perform experiments, analyze data, and document results, while maintaining high quality and timely execution. Proficient English is required for reporting and collaboration.