Process Integration Engineer — CMOS/TSV Specialist

ams-OSRAM AG

Unterpremstätten

Vor Ort

EUR 65.000 - 90.000

Vollzeit

Vor 8 Tagen
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Benefits dieser Stelle

Competitive salary
Benefits based on performance

Zusammenfassung

ams OSRAM Group in Austria is seeking a Process Integration Engineer (d/m/f) for CMOS/TSV processes at wafer level. You will supervise production and collaborate with Process Engineering, R&D and QA to optimize yield and costs.

Master’s or PhD in Physics/Chemistry/Materials Science or related field is required, with strong analytical skills. Fluency in English; German is advantageous. Two-year fixed-term contract with competitive benefits.

Qualifikationen

  • Master’s or PhD in Physics, Chemistry, Materials Science or related field.
  • Initial professional experience in a comparable role is preferred; experience in customer communication and 8D problem-solving is a plus.
  • Strong analytical and problem-solving skills; Six Sigma knowledge is a plus.
  • Excellent organizational, communication, and stakeholder management skills.
  • Ability to lead and coordinate cross-functional teams and optimize new processes.

Aufgaben

  • Process integration representative for CMOS/TSV processes at wafer level.
  • Supervise and monitor manufacturing of the process technology with Process Engineering, R&D, QA, etc.
  • Optimize processes and solve problems in collaboration with Test, Product Engineering and Design teams.
  • Evaluate and implement process simplifications to lower costs and increase robustness.
  • Transfer new technologies from R&D into production.
  • Take PI responsibility at customer audits and reporting data to key customers.
  • Stabilize technologies by supervising lead products and improving yield.

Kenntnisse

CMOS processes
TSV processes
Cross-functional leadership
Analytical problem-solving
Customer communication

Ausbildung

Master’s degree in Physics/Chemistry/Materials Science
PhD in Physics/Chemistry/Materials Science or related

Jobbeschreibung

ams OSRAM Group in Austria is seeking a Process Integration Engineer (d/m/f) for CMOS/TSV processes at wafer level. You will supervise production and collaborate with Process Engineering, R&D and QA to optimize yield and costs.

Master’s or PhD in Physics/Chemistry/Materials Science or related field is required, with strong analytical skills. Fluency in English; German is advantageous. Two-year fixed-term contract with competitive benefits.

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