Senior RF IC Package & PCB Layout Engineer

ams OSRAM; Premstätten; Vor Ort; EUR 90.000 - 130.000; Vollzeit

Zusammenfassung

ams OSRAM is seeking an experienced RF and high-frequency IC layout engineer in Austria. You will design and optimize RF/mixed-signal substrate and PCB layouts, ensuring SI/PI performance and manufacturability while coordinating with EMC, analog, package, and IC design teams.

The role requires 6+ years in semiconductor/electronic industries, strong Cadence Allegro and/or Altium experience, and knowledge of RF matching networks and packaging technologies.

Qualifikationen

• Bachelor’s or Master’s in Electrical Engineering, Microelectronics, or a related field.
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Aufgaben

• Design and develop RF and high-frequency IC substrate and PCB layouts for sensor and mixed-signal applications.

Kenntnisse

Cadence Allegro Suite

Altium Designer

Cadence Virtuoso

EM/ESD concepts

RF/layout optimization

HDI PCB

BGA/wirebond/flip-chip

CMC/EMI control

Ausbildung

Bachelor's or Master’s in Electrical Engineering

Microelectronics/ Semiconductor Physics

Tools

Cadence Allegro Suite (Allegro X, APD, Package Designer)

Altium Designer

Cadence Virtuoso Suite

Siemens Calibre / PVS

Jobbeschreibung

ams OSRAM is seeking an experienced RF and high-frequency IC layout engineer in Austria. You will design and optimize RF/mixed-signal substrate and PCB layouts, ensuring SI/PI performance and manufacturability while coordinating with EMC, analog, package, and IC design teams.

The role requires 6+ years in semiconductor/electronic industries, strong Cadence Allegro and/or Altium experience, and knowledge of RF matching networks and packaging technologies.